| Allicdata Part #: | ATS-20C-17-C3-R0-ND |
| Manufacturer Part#: |
ATS-20C-17-C3-R0 |
| Price: | $ 4.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-17-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.80520 |
| 30 +: | $ 3.59415 |
| 50 +: | $ 3.38260 |
| 100 +: | $ 3.17123 |
| 250 +: | $ 2.95982 |
| 500 +: | $ 2.74840 |
| 1000 +: | $ 2.69555 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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?< div>Thermal - Heat Sinks
The ATS-20C-17-C3-R0 is a thermal-heat sink designed to dissipate large amounts of heat from electronic devices. The device consists of a Teflon thermal pad, a hollow aluminum-finned plate, and a thermally insulated cover. The thermal pad sits between the electronic device and the plate, which dissipates the heat through convection. The thermally insulated cover prevents the heat from unintentionally escaping into the environment.
Application Field
The ATS-20C-17-C3-R0 is ideal for use in high-powered electronics, such as servers and medical equipment. The large thermal capacity of the device ensures that the device can handle large and heavy workloads. Additionally, the plate is easily mounted into a variety of applications, allowing for quick installation into a variety of enclosures.
Working Principle
The ATS-20C-17-C3-R0 works on the principle of thermal conduction. Heat from the electronic device flows through the Teflon thermal pad and into the plate where it is dissipated by convection. The fins on the plate help to increase surface area and enhance cooling efficiency. The thermally insulated cover prevents any escaped heat from entering the environment.
Advantages
The ATS-20C-17-C3-R0 is an effective and reliable device for dissipating excess heat from electronic components. The large thermal capacity of the device allows it to handle heavy workloads without overheating. Additionally, the device is easy to install and does not require a lot of maintenance.
Conclusion
The ATS-20C-17-C3-R0 is a thermal-heat sink designed to efficiently dissipate excess heat from electronic components. The device is simple to install and requires very little maintenance, making it an ideal choice for high-powered applications. The device is an effective and reliable solution for managing heat and preventing components from overheating.
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