| Allicdata Part #: | ATS-20C-172-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-172-C1-R0 |
| Price: | $ 3.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-172-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16638 |
| 30 +: | $ 3.08091 |
| 50 +: | $ 2.90984 |
| 100 +: | $ 2.73861 |
| 250 +: | $ 2.56747 |
| 500 +: | $ 2.48188 |
| 1000 +: | $ 2.22514 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-20C-172-C1-R0 Thermal - Heat Sinks Application Field and Working Principle
The ATS-20C-172-C1-R0 thermal - heat sink is a thermally enhanced, high performance module designed to dissipate heat from electronic components. This device is widely used in the fields of computer, telecommunication, automotive, industrial equipment and consumer electronic equipment.
The ATS-20C-172-C1-R0 thermal - heat sink utilizes a series of interconnected plates, each of which is made of a solid thermally conductive material. The plates are arranged in an array in order to maximize the surface area exposed to the ambient air. This allows for maximum heat dissipation. The plates are machined to a very fine tolerance in order to provide low thermal resistance. The heat dissipation is enhanced by the use of a patented heat transfer technology called Thermal Displacement.
The ATS-20C-172-C1-R0 thermal - heat sink is designed to work with all types of electronic components. It is capable of dissipating heat generated from high power processors, voltage regulators, power management ICs, and other heat producing electronic components. The device is equipped with a heat spreader plate, which is made of a heat conductive material such as aluminum or copper. This plate serves to spread the heat evenly over the entire surface of the heat sink, enabling efficient heat transfer.
The working principle of the ATS-20C-172-C1-R0 thermal - heat sink is based on the well-known laws of thermodynamics. As heat is generated by the electronic components, it is conducted to the cooling plate. The cooling plate dissipates the heat to the surrounding air and the heat is transferred to the cooler air. This transfer of heat helps to regulate the operating temperature of the component, thus ensuring its proper functioning.
The ATS-20C-172-C1-R0 thermal - heat sink is designed for use in extreme temperature applications. It is designed to operate in temperatures ranging from -76°F to +300°F. The device is constructed of materials that are highly resistant to thermal wear and tear, making it suitable for use in harsh environments. In addition, the device is designed to be highly efficient in dissipating heat from low power chips and other electronics components.
The ATS-20C-172-C1-R0 thermal - heat sink is suitably designed to fit most electronic devices. It is highly efficient in dissipating heat in a variety of applications, such as automotive, industrial, and consumer electronics. It is easy to install and maintain, and the device is designed to be highly reliable and long lasting.
The specific data is subject to PDF, and the above content is for reference