| Allicdata Part #: | ATS-20C-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-173-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23694 |
| 30 +: | $ 3.14979 |
| 50 +: | $ 2.97473 |
| 100 +: | $ 2.79972 |
| 250 +: | $ 2.62473 |
| 500 +: | $ 2.53725 |
| 1000 +: | $ 2.27478 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is important to ensure the proper functioning of an electrical device. Without efficient thermal management, operating temperatures can rise quickly and shorten the lifespan of the device. Thermal heat sinks are designed to dissipate the heat that accumulates in the device by absorbing and dispersing the thermal energy into the surrounding environment. The ATS-20C-173-C1-R0 Thermal-Heat Sink is designed to dissipate heat generated by electrical components and circulate the air around them to maintain the optimal operating temperature.
The ATS-20C-173-C1-R0 Thermal-Heat Sink is a high-performance thermal management solution that is easy to install and use. The design of the heat sink allows for excellent air flow and decreased noise levels. The fanless design is ideal in applications where noise is a factor, such as in many consumer electronics. The C1-R0 model is designed for applications that require a high level of performance with no fan or active cooling system.
The Thermal-Heat Sink is made of aluminum to provide superior thermal conductivity. The heat sink has a unique fin design which maximizes the heat transfer rate and the air flow rate. The combination of the fin design and the aluminum material ensures that the Thermal-Heat Sink can provide excellent cooling performance and a low acoustic profile. The thermal-heat sink has a low profile which is ideal for applications where the space is at a premium.
The ATS-20C-173-C1-R0 Thermal-Heat Sink can be used in a wide variety of applications. It is commonly used in industrial, medical, military, and consumer electronics. The heat sink is a cost-effective solution that can be used to dissipate the heat generated by a range of components including processors, voltage regulators, and motor controls. The heat sink can also be used in light-duty power circuits, such as transistors and diodes.
The ATS-20C-173-C1-R0 Thermal-Heat Sink works on the principle of convection. It utilizes natural processes to transfer heat through the air. The thermal-heat sink uses fins to create convection currents and to efficiently transport heat away from the device. These convection currents are further enhanced by the fanless design, allowing the thermal-heat sink to effectively dissipate the heat without making any noise.
The ATS-20C-173-C1-R0 Thermal-Heat Sink is an effective thermal management solution that can be used in a variety of applications. The heat sink’s low profile and fanless design make it an ideal choice for applications where space is at a premium or where noise levels must be kept to a minimum. The excellent thermals and air flow allow the sink to dissipate the heat generated by the device efficiently and quietly.
The specific data is subject to PDF, and the above content is for reference