| Allicdata Part #: | ATS-20C-174-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-174-C1-R0 |
| Price: | $ 3.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-174-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.33144 |
| 30 +: | $ 3.24135 |
| 50 +: | $ 3.06130 |
| 100 +: | $ 2.88118 |
| 250 +: | $ 2.70109 |
| 500 +: | $ 2.61106 |
| 1000 +: | $ 2.34095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.98°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-20C-174-C1-R0 thermal-heat sink is an essential component in a wide variety of applications, from electronics to consumer products and industrial equipment. By allowing heat to escape from the device or application, it allows the device to remain cool and efficient. This article will discuss the application field and the working principle of this thermal-heat sink.
The most common application area for the ATS-20C-174-C1-R0 thermal-heat sink is in telecommunications, computers, and other electronic equipment. This thermal-heat sink is designed to allow heat to escape from the device, ensuring that the device remains cool and maxes out its efficiency. It can also be used in consumer products, such as in home appliances, to reduce their energy consumption and make them more efficient.
The working principle of the ATS-20C-174-C1-R0 thermal-heat sink is fairly straightforward. Heat produced by an electronic component or other device is transferred via the thermal pad onto the surface of the heat sink. The heat is then transferred away from the device by the heat sink’s heat pipes and fins, which are designed to efficiently dissipate the heat. The fins and heat pipes are made from highly efficient materials that allow the device to maintain a constant temperature, and to keep it running efficiently.
The ATS-20C-174-C1-R0 thermal-heat sink is able to efficiently transfer heat away from the device or application, ensuring that the device does not overheat and can achieve maximum efficiency. It is lightweight and compact, making it an ideal choice for use in telecommunications, computers, and other electronic equipment. It is also highly durable, allowing it to perform for a long period of time without any issues.
In conclusion, the ATS-20C-174-C1-R0 thermal-heat sink is an essential component for a wide variety of applications, from electronics to consumer products and industrial equipment. It is designed to transfer heat away from the device, and is made from high-efficiency materials that allow the device to maintain a constant temperature and maximum efficiency. It is lightweight and compact, making it ideal for many uses, and is highly durable for consistent performance over time.
The specific data is subject to PDF, and the above content is for reference