ATS-20C-175-C3-R0

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Thermal management for industrial electronics, computer routers, and other applications has become increasingly important as technology becomes more powerful. As such, the ATS-20C-175-C3-R0 heat sink has become a popular choice for providing efficient cooling. The unique design of the ATS-20C-175-C3-R0 makes it ideal for applications in which significant heat generation is expected and in which the size of the heat sink must be kept to a minimum.

The ATS-20C-175-C3-R0 is an active thermoelectric cooler (TEC) designed to endure in temperatures between -40°C and +85°C and provide up to 175 watts of cooling capacity when accurately mounted. The coolers are designed to provide precise heat removal in applications where existing fans, fans with similar power levels, or other cooling devices lack the capability to sufficiently meet the cooling demand. Additionally, the cooler’s design ensures maximum mounting flexibility. The cooler is constructed of a lightweight aluminum alloy, which has a dielectric strength of 600 volts/mil (V/Mil).

The design of the ATS-20C-175-C3-R0 heat sink relies on two primary components to achieve cooling: a thermoelectric module and a conventional aluminum extruded heat sink. The thermoelectric module and heat sink are connected together by a combination of mounting clips, thermal paste, and thermal devices. The thermoelectric module consists of an array of thermoelements residing between two electrically conductive surfaces. The thermoelements are designed to convert an electrical current into a thermal energy flow. As the electrical current flows through the thermoelement, the thermal flow dissipates energy from the interface between the two surfaces. This thermal energy is then absorbed by the aluminum extruded heat sink.

The aluminum extruded heat sink is designed to continually dissipate the thermal energy sent by the thermoelectric module. By using fins to increase the surface area of the heat sink, the aluminum extruded heat sink is able to efficiently draw heat away from the thermoelement. The heat sink is designed to absorb the thermal energy and dissipate it into the surrounding environment. The number of fins on the heat sink plays a significant role in its cooling capability. Depending on the application, the number of fins can vary from 0-25 per side. By using differing fin angles and a variety of types of air channels, the ATS-20C-175-C3-R0 heat sink is able to dissipate the thermal energy as efficiently as possible.

The combination of the thermoelectric module and the aluminum extruded heat sink makes the ATS-20C-175-C3-R0 an ideal choice for applications that require efficient thermal management. The heat sink is lightweight and versatile enough to be used in a variety of applications, including computing, communications, and industrial electronics. With its low profile and high cooling capacity, the ATS-20C-175-C3-R0 is the perfect choice for applications in which size and thermal performance are a primary concern.

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