| Allicdata Part #: | ATS-20C-176-C3-R0-ND |
| Manufacturer Part#: |
ATS-20C-176-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-20C-176-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.73°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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There are many different thermal - heat sinks available on the market today, and ATS-20C-176-C3-R0 is one of them. ATS-20C-176-C3-R0 is designed to efficiently remove heat from the system in order to prevent overheating. This heat sink is able to perform a variety of cooling applications, making it a great option for many different types of systems.
In general, thermal - heat sinks are designed to dissipate heat away from the system and to help keep it running cool and stable. The ATS-20C-176-C3-R0 uses a combination of many different materials to achieve this, including aluminum, copper, and a specially designed metal substrate. The heat sink utilizes a unique pin-fin design that maximizes the amount of surface area for air to be cooled. This design helps to ensure that the heat is removed quickly and efficiently.
In addition to its unique pin-fin design, the ATS-20C-176-C3-R0 also uses a two-part thermal pad which helps to increase the thermal conductivity of the heat sink. This thermal pad helps to ensure that the heat is spread over the entire surface area, as opposed to a single point. This also helps to increase the effectiveness of the heat sink, as the heat can be evenly spread across the entire heat sink without any hotspots.
The ATS-20C-176-C3-R0 is designed to be used in a number of applications, including GPUs, CPUs, hard drives, and many more. It is designed to be used with any system that requires a high level of thermal management or cooling. This includes gaming systems, streaming systems, servers, and computer systems.
The working principle of the ATS-20C-176-C3-R0 is fairly simple. It works by dissipating the heat away from the system and out into the atmosphere. The heat is drawn in from the system and then passed through a series of heat dissipation layers. These layers are designed to help to separate the heat from the rest of the system and reduce its temperature. As the heat passes through each layer, its temperature is reduced, and the system is then cooled by the ambient air present in the environment.
In conclusion, ATS-20C-176-C3-R0 is a great heat sink option for many different applications. It is designed to provide efficient and effective cooling, helping to keep systems running stable and cool. This heat sink is also easy to install and is a cost-effective option when considering thermal - heat sinks.
The specific data is subject to PDF, and the above content is for reference
ATS-20C-176-C3-R0 Datasheet/PDF