ATS-20C-185-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-20C-185-C1-R0-ND

Manufacturer Part#:

ATS-20C-185-C1-R0

Price: $ 3.80
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X30MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20C-185-C1-R0 datasheetATS-20C-185-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.44925
30 +: $ 3.35580
50 +: $ 3.16940
100 +: $ 2.98299
250 +: $ 2.79654
500 +: $ 2.70332
1000 +: $ 2.42367
Stock 1000Can Ship Immediately
$ 3.8
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.32°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are one of the most important components of electronic systems, and ATS-20C-185-C1-R0 is a leading heat sink product in the industry. This type of heat sink is designed to provide efficient cooling performance, to protect electronic components from over-heating and to enhance product performance and quality. In this article, we will take an in-depth look at the application field and working principle of ATS-20C-185-C1-R0.

The ATS-20C-185-C1-R0 heat sink is most commonly used in the aerospace, automotive, computer, telecommunications, and defense industries. It is capable of handling high thermal loads, and its design is optimized to reduce thermal resistance while providing an extremely low profile. It is suitable for use with power transistors, mosfets, and other power components that suffer from high thermal characteristics. The ATS-20C-185-C1-R0\'s unique profile also allows for quick and easy installation and removal.

The working principle of ATS-20C-185-C1-R0 heat sink is based on the concept of natural convection cooling. This type of cooling is the process of heat transfer through a medium, typically air, from a hotter to a cooler area. The process utilizes the natural tendency of hot air to rise, thus pushing cooler air towards the components on the heat sink. As the hot air rises, it is cooled off by ambient air, allowing it to sink back down and be replaced by cooler air. This creates a continuous cycle of airflow that is capable of keeping the components on the heat sink at a relatively cool temperature.

ATS-20C-185-C1-R0 utilizes a high-efficiency fin design to increase overall thermal performance. The fin profile is designed to optimize airflow and maintain a natural convection cooling process that is effective for highly temperature-sensitive systems. Furthermore, the fin profile also drastically reduces airflow turbulence, resulting in much quieter operation. Other features of the ATS-20C-185-C1-R0 include passive thermal management, high durability and corrosion resistance, and a wide range of temperature ranges to suit various applications.

When considering ATS-20C-185-C1-R0, it is important to consider its application field and working principle. It is most commonly used in many high-performance electronic systems, and its unique fin design provides efficient cooling performance while reducing turbulence and noise. Moreover, its passive thermal management ensures that the components on the heat sink remain at a safe, cool temperature while providing a long life-span and excellent durability. ATS-20C-185-C1-R0 is an ideal choice for many electronic applications that require reliable performance and quiet operation.

The specific data is subject to PDF, and the above content is for reference

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