| Allicdata Part #: | ATS-20C-186-C3-R0-ND |
| Manufacturer Part#: |
ATS-20C-186-C3-R0 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-186-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-20C-186-C3-R0 is a thermal-heat sink designed and manufactured for a variety of applications. It is utilized primarily in electrical and electronic applications in which the device needs to be cooled quickly and efficiently to protect components from burnout. This type of heat sink is designed to quickly dissipate heat through the convection process. This allows it to be used effectively in both high-power and small, space-constrained applications.
The thermal-heat sink can be used in transformer, circuit breaker, capacitor and battery applications. In most cases it has the ability to reduce the internal temperature of an electronic or electrical device by up to 60 degrees Celsius. This is thanks to its high exchange rate of heat and its ability to quickly radiate heat away from the device.
In its most basic form, the ATS-20C-186-C3-R0 is composed of a one- or two-piece aluminum construction. This construction provides a low-cost, reliable product and is a simple solution for most applications. It is particularly noted for its low thermal resistance, which allows it to be used in applications where other heat sinks cannot be used.
The device has a high thermal conductivity rating and is designed to be erected on a flat surface without the need for mounting hardware. It can also be mounted directly onto the device’s circuit board. The heat sinks are designed to have a high heat-dissipation rate. This rate is further enhanced via its natural convection design.
The ATS-20C-186-C3-R0 can be used in both forced-air and natural-convection applications. In forced-air applications, an air mover can be used to direct heated air away from the device, and in natural-convection-based applications, the heat sink works with natural air flow.
The heat sink has an effective thermal resistance of 0.3°C/W. This allows it to dissipate temperatures of up to 200°C. The device is also compatible with most available thermal management materials, such as thermal greases, compounds, and other materials. Additionally, it is easy to install, maintain, and replace.
The ATS-20C-186-C3-R0 thermal-heat sink is an effective way to reduce the temperature of electronic and electrical components, and to protect those components from burnout. Its high rate of heat dispersion and efficient natural convection design make it an ideal choice for a variety of applications, from high-powered devices to more compact, space-constrained systems. Its compatibility with thermal management materials, low maintenance needs, and ease of installation, make it an excellent choice for use in electronic and electrical systems.
The specific data is subject to PDF, and the above content is for reference