| Allicdata Part #: | ATS-20C-192-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-192-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-192-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58470 |
| 30 +: | $ 3.38583 |
| 50 +: | $ 3.18654 |
| 100 +: | $ 2.98746 |
| 250 +: | $ 2.78828 |
| 500 +: | $ 2.58911 |
| 1000 +: | $ 2.53931 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks
The ATS-20C-192-C1-R0 is a heat sink designed to cater to a wide range of applications. This heat sink\'s design is based on the principles of thermal convection, a phenomenon whereby heated air rises and cold air descends. This type of thermal convection-based heat sink utilizes fins that are distributed radially around the outer surfaces of the heat sink and utilize the dissipated heat from the device being cooled to create a natural convection current to take the heat away.
This heat sink is designed for applications with exposed areas that dissipate heat from an internal component and is made from a heat-conductive material such as aluminium or copper. It can also be coated with a heat-resistant or insulative coating, such as a PTFE or silicone based coating to reduce corona losses. This coating can also be used to improve airflow around the heat sink, which can help in cooling the device faster.
The ATS-20C-192-C1-R0 is designed for large, high-powered components and is ideal for applications such as solar panels, servers, and other equipment where high temperatures need to be dissipated. The large surface area of the fins allows for an effective transfer of heat away from the component, and the efficient cooling allows for increased system reliability and better protection against component damage and failure.
The ATS-20C-192-C1-R0 heat sink also maximizes the effectiveness of air flow, which helps in avoiding condensation and corrosion. The base of the heat sink has a built-in airflow guide to allow for the optimal airflow. The fins are also angled towards the airflow source to increase the temperature difference between the air and the heat sink. The geometry of the fins also ensures that the air passing through them is accelerated, which increases the heat dissipation rate.
The ATS-20C-192-C1-R0 is an effective thermal solution for applications where large, high-powered components need to be cooled. The efficient thermal convection and the maximized air flow help to achieve an effective cooling rate while reducing component damage and failure. This heat sink is also designed to be energy efficient and can help reduce power consumption and extend the life of the component being cooled.
The specific data is subject to PDF, and the above content is for reference