| Allicdata Part #: | ATS-20C-195-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-195-C1-R0 |
| Price: | $ 3.10 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-195-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78964 |
| 30 +: | $ 2.71446 |
| 50 +: | $ 2.56360 |
| 100 +: | $ 2.41284 |
| 250 +: | $ 2.26205 |
| 500 +: | $ 2.18664 |
| 1000 +: | $ 1.96044 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-20C-195-C1-R0 is a type of thermal - heat sink that is used to dissipate heat away from both high temperature components and the surrounding environment. This type of thermal heat sink works by transferring the thermal energy generated by the on-board component otherwise usually an integrated circuit alike to a surface area, enabling the heat to disperse in a relatively efficient and safe way. This type of heat sink generally consists of a metal plate, with a flat surface to mount the component onto and a series of fins on top of it which act as a convective surface.
This convective surface helps to disperse the heat generated by the component to the surrounding air, the fins increasing the exterior surface area which enables the heat energy to disperse from the heat sink more quickly. Generally an external fan is needed for the heat sinks of this type to operate efficiently as this helps to draw cooler air into the region between the fins, this cooler air then passes over the hot surface of the heat sink and takes away the thermal energy, which is then blown out of the other side. This helps to dissipate the heat with greater efficiency, reducing the temperature of both the component and the environment.
The ATS-20C-195-C1-R0 thermal heat sink is designed for use in high power and high temperature applications, and has a thermal resistance of 0.25°C/W (1.0W at 25°C). This enables it to dissipate up to 1.0 W at 25°C, reducing the temperature of both the component and the environment. This low thermal resistance also provides efficient cooling for applications with higher power components such as processors and amplifiers, allowing them to operate at their full potential without risking an over-temperature shut-down.
In addition, the ATS-20C-195-C1-R0 provides an attractive, low-profile design which aesthetically blends with any application. It is well-suited for applications where a compact thermal solution is required. The profile height of this type of thermal heat sink is only 21.5mm, making it an ideal solution for embedded applications where a low profile is a must. The maximum mounting force of this thermal heat sink along with its high performance allows it to work in the widest range of applications from consumer electronics to automotive and industrial applications.
Overall, the ATS-20C-195-C1-R0 thermal heat sink is an excellent choice for applications which require a combination of high heat dissipation and a low profile form factor. This type of thermal heat sink is suitable for a variety of applications, providing an effective way to dissipate the heat generated by components and the surrounding environment, while also providing an aesthetically pleasing solution.
The specific data is subject to PDF, and the above content is for reference