| Allicdata Part #: | ATS-20C-197-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-197-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-197-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.77830 |
| 30 +: | $ 2.70291 |
| 50 +: | $ 2.55289 |
| 100 +: | $ 2.40269 |
| 250 +: | $ 2.25250 |
| 500 +: | $ 2.17742 |
| 1000 +: | $ 1.95217 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important and critical aspects of electronics design, and heat sinks are commonly used to help dissipate the heat generated by electronic components, cooling systems, and power supplies. The ATS-20C-197-C1-R0 is a specially designed heat sink designed to control temperatures up to 200°F (93°C). It is ideal for use in applications that require efficient heat removal.
The ATS-20C-197-C1-R0 is constructed using a combination of thermally conductive materials and aluminum fins, and is designed with an innovative cooling system. The system includes a copper heat spreader and an aerodynamic extruded aluminum structure with a fin pattern for maximum cooling efficiency. This heat sink is capable of achieving temperatures up to 197°F (92°C) at the top of the thermal fins, with a delta T of 20°F (11°C). In addition, the ATS-20C-197-C1-R0 features an adjustable fan mount that adjusts the inclination of the fins to optimize air flow. The fan mount also allows for the installation of small fans that can provide additional cooling for the system.
The ATS-20C-197-C1-R0 is designed to reduce the thermal resistance of hot components and electronics, and can easily control temperatures up to 197°F (92°C). This makes it an ideal choice for applications that require efficient heat removal, such as computer CPUs and memories, servers, power supplies, telecommunications equipment, and automotive applications. The heat sink is also designed to be compatible with a wide range of air or liquid cooling solutions.
The ATS-20C-197-C1-R0 is an innovative and efficient heat sink design that is suitable for a wide range of applications. Its combination of thermally conductive materials and aluminum fins provides efficient heat removal up to 197°F (92˚C). The adjustable fan mount allows for the installation of small fans to provide additional cooling. In addition, the aluminum fin structure and aerodynamic design maximize air flow for improved cooling efficiency. This makes the ATS-20C-197-C1-R0 an excellent choice for applications that require efficient thermal management and heat removal.
The specific data is subject to PDF, and the above content is for reference