| Allicdata Part #: | ATS33249-ND |
| Manufacturer Part#: |
ATS-20C-197-C2-R0 |
| Price: | $ 3.76 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-197-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.42090 |
| 10 +: | $ 3.32892 |
| 25 +: | $ 3.23870 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal – Heat Sinks: ATS-20C-197-C2-R0 Application Field and Working Principle
When it comes to industrial-grade electronic equipment, such as power supplies, circuit boards, and other devices, thermal management is one of the most important components of the system. In industrial applications, heat sinks and fans are used to dissipate heat away from components in order to extend component life and prevent system shutdowns. The ATS-20C-197-C2-R0 is a heat sink designed specifically for industrial applications. This article describes the application field and working principle of the ATS-20C-197-C2-R0.
Application Field of the ATS-20C-197-C2-R0
The ATS-20C-197-C2-R0 is an aluminum extruded heat sink used to dissipate heat from electronic components. It is optimized for industrial use because it features a robust, anodized finish that is highly resistant to corrosion. With its large surface area, it is capable of dissipating heat efficiently over a large range of workloads. The device is also UL94V-0 approved for fire safety, which makes it suitable for applications requiring the highest level of safety and reliability.
The ATS-20C-197-C2-R0 is particularly suitable for applications such as power supplies, microcontrollers, data storage devices, and other systems that require the highest levels of thermal management and reliability. The device is capable of dissipating a large quantity of heat within a short time, making it particularly suitable for situations where system shutdowns due to overheating must be avoided. In addition, its large surface area enables it to dissipate heat away from components quickly and efficiently.
Working Principle of the ATS-20C-197-C2-R0
The ATS-20C-197-C2-R0 is designed to dissipate heat from electronic components using a combination of convection, radiation, and conduction. The device features a large surface area that is designed to maximize the rate of heat transfer from the component to the surrounding environment. In addition, the device is designed to allow air to flow across its surface, which further increases the rate of heat transfer. The aluminum construction of the device helps improve its radiative properties, allowing heat to be dissipated more quickly and efficiently than other materials.
As well as its large surface area and radiative properties, the ATS-20C-197-C2-R0 is designed to maximize the efficiency of conduction by minimizing the distance between the heat-generating component and the device. This allows it to draw heat away from the component quickly and efficiently. Finally, the device is designed to minimize contact resistance between the heat sink and the component, which helps prevent overheating due to thermal choking.
Conclusion
In summary, the ATS-20C-197-C2-R0 is an industrial-grade aluminum extruded heat sink designed specifically for dissipating heat away from electronic components. It is particularly suitable for applications requiring the highest levels of thermal management and reliability, such as power supplies and microcontrollers. The device is designed to dissipate heat using a combination of convection, radiation, and conduction, and its robust design makes it capable of dissipating a large quantity of heat within a short time. By following the principles outlined in this article, engineers can ensure that their systems are optimally cooled, extend the life of components, and reduce the risk of system shutdowns due to overheating.
The specific data is subject to PDF, and the above content is for reference