ATS-20C-20-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20C-20-C3-R0-ND

Manufacturer Part#:

ATS-20C-20-C3-R0

Price: $ 4.67
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20C-20-C3-R0 datasheetATS-20C-20-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.19895
30 +: $ 3.96543
50 +: $ 3.73225
100 +: $ 3.49896
250 +: $ 3.26570
500 +: $ 3.03243
1000 +: $ 2.97412
Stock 1000Can Ship Immediately
$ 4.67
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

Heat sinks are an essential component for managing thermal energy and controlling temperature in many electrical and electronic devices. ATS-20C-20-C3-R0 is a particularly effective and powerful type of thermal heat sink. It is used in a wide range of applications in order to effectively and efficiently manage thermal energy dissipation. In this article, we will explore the application field and working principle of ATS-20C-20-C3-R0.

Application Field

The ATS-20C-20-C3-R0 thermal heat sink is designed for use in a variety of consumer electronics, including computers, gaming consoles, cell phones, and any other products that require thermal management. It is particularly effective for devices that generate a lot of heat, such as powerful processors for gaming or high-end video cards. The ATS-20C-20-C3-R0 can also be used to dissipate thermal energy from LED lighting components, motors, and other electronics.

The ATS-20C-20-C3-R0 is designed to provide an effective thermal management solution. It has a high thermal impedance, which means that it is able to dissipate large amounts of thermal energy quickly and efficiently. In addition, it has a low profile, which makes it ideal for use in tight spaces. The ATS-20C-20-C3-R0 also features a low acoustic noise level, making it a great choice for both consumer electronics and motor applications.

The ATS-20C-20-C3-R0 is also engineered to be extremely reliable and durable. Its robust construction is capable of withstanding extreme temperatures, vibrations, and shock. It is designed to last for many years, making it an ideal choice for long-term use.

Working principle

The ATS-20C-20-C3-R0 thermal heat sink is designed to dissipate thermal energy through a process known as convection. In this process, the heat generated by an electrical or electronic device is transferred to the heat sink by air molecules that interact with the metal fins of the heat sink. Heat from the device is absorbed by the metal fins and then dissipated into the surrounding air. In this way, the temperature of the device is lowered, and the thermal energy is effectively managed.

The ATS-20C-20-C3-R0 is specifically designed to make use of convection to dissipate heat. The metal fins are spaced out evenly and the airflow gap between them is optimized so that air molecules can move freely and dissipate heat quickly and efficiently. The careful design of the heat sink ensures that air molecules are able to absorb maximum thermal energy and then dissipate it quickly.

The ATS-20C-20-C3-R0 is designed to be both efficient and reliable. The metal fins are plated with a corrosion-resistant coating that protects them from oxidation. This coating ensures that the fins are able to effectively dissipate thermal energy for many years without any degradation. In addition, the design of the heat sink minimizes any backflow of air, which increases efficiency and ensures that cost-effectively distribute thermal energy.

In summary, the ATS-20C-20-C3-R0 thermal heat sink is an effective and reliable solution for managing thermal energy from electrical and electronic devices. It is designed to be efficient, with an optimized airflow gap and corrosion-resistant coating, and durable, with its robust construction able to withstand extremes of temperature and shock. The ATS-20C-20-C3-R0 is ideal for use in a wide range of consumer electronics and other applications that require effective thermal management.

The specific data is subject to PDF, and the above content is for reference

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