| Allicdata Part #: | ATS-20C-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-20C-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks provide cooling solutions for thermal-electronic applications involving heat dissipation. The ATS-20C-200-C3-R0 is a great example of such a device. It is a natural-convection-cooled heat sink designed to handle both active and passive cooling applications.
The ATS-20C-200-C3-R0 thermal-heat sink can provide efficient heat dissipation in a wide variety of applications, including consumer electronics such as mobile phones, computers, and gaming systems. It can also be used in industrial applications with high thermal loads such as lighting systems, medical equipment, and more.
The ATS-20C-200-C3-R0 is designed to maintain high heat transfer rates in a wide range of temperatures. It is constructed of aluminum fins with thin grooves cut into them, which helps increase surface area and improve heat dissipation. Additionally, it is designed to mount on PCBs and can be used with fanless heat dissipation systems. It is a lightweight solution for managing thermal loads and can be used in a wide range of environments.
The ATS-20C-200-C3-R0’s working principle is based on natural convection. This is a process in which air is heated and rises, carrying the thermal energy away from the device. As the air cools, it drops and the cooling cycle starts again. This is an efficient and cost effective way to manage thermal loads as it does not require additional power or specialized circuitry to manage the thermal loads.
The ATS-20C-200-C3-R0 is a versatile, efficient, and cost-effective solution for managing thermal loads in a wide range of environments. Its natural convection working principle provides an efficient and reliable thermal management solution for thermal electronic applications requiring high heat dissipation rates. Its lightweight design and easy to mount design make it ideal for consumer electronics applications and more.
The specific data is subject to PDF, and the above content is for reference