| Allicdata Part #: | ATS-20C-24-C3-R0-ND |
| Manufacturer Part#: |
ATS-20C-24-C3-R0 |
| Price: | $ 5.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-24-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.85793 |
| 30 +: | $ 4.58808 |
| 50 +: | $ 4.31827 |
| 100 +: | $ 4.04838 |
| 250 +: | $ 3.77849 |
| 500 +: | $ 3.50860 |
| 1000 +: | $ 3.44112 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.43°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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AThe ATS-20C-24-C3-R0 thermal heat sink is designed for applications in multiple industries. It is a modulated metal-finned extrusion with self-contained microprocessors and heat transfer materials capable of dissipating heat away from critical components. With unmatched reliability, ATS-20C-24-C3-R0 heat sinks can be used in telecommunications, industrial, automotive, and consumer electronics.
The ATS-20C-24-C3-R0 thermal heat sink is designed for optimal heat dissipation and to reduce thermal runaway. The extrusion is made from high-grade aluminum which allows for excellent heat transfer capability. The structured fins increase the surface area significantly, allowing for more efficient dissipation of heat away from the containment box. The finless body and internal heat spreader also spread the heat away from the center of the containment box, resulting in an even temperature distribution.
The MicroProcessor in the ATS-20C-24-C3-R0 ensures optimal temperature management through the use of circuitry. This circuitry is capable of detecting changes in temperature and adjusting the airflow to ensure that the heat generated is dissipated correctly. To ensure the best possible heat dissipation, the ATS-20C-24-C3-R0 uses air-to-air forced convection. This method helps to draw warm air away from components and dissipate it more quickly.
The ATS-20C-24-C3-R0 thermal heat sink is extremely reliable and is capable of withstanding high temperatures for extended periods of time. The device is also designed with external protective features, preventing the accumulation of dust and other particles on the internal components. The ATS-20C-24-C3-R0 is designed to be used in harsh environmental conditions and still provide maximum performance.
The ATS-20C-24-C3-R0 heat sinks are used in a variety of industries and applications. They are used in telecommunications systems to manage the levels of heat, reduce the risk of overheating and failure of any vital components. They are also used in industrial equipment, ensuring that the components do not overheat, leading to a breakdown of the device. The ATS-20C-24-C3-R0 heat sink is also used in automotive and consumer electronics, including laptops, tablets, and smartphones.
The ATS-20C-24-C3-R0 thermal heat sink offers versatile, cost-effective passive cooling solutions. It is designed to dissipate heat effectively, while also being resistant to physical damage. The ATS-20C-24-C3-R0 is a reliable and robust device that can be used in multiple industries to reduce the risk of thermal runaway and overheating of components.
The specific data is subject to PDF, and the above content is for reference