| Allicdata Part #: | ATS-20C-29-C3-R0-ND |
| Manufacturer Part#: |
ATS-20C-29-C3-R0 |
| Price: | $ 7.62 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-29-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.86070 |
| 30 +: | $ 6.45687 |
| 50 +: | $ 6.05329 |
| 100 +: | $ 5.64971 |
| 250 +: | $ 5.24619 |
| 500 +: | $ 5.14530 |
| 1000 +: | $ 5.04441 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.61°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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?Thermal management is an important factor in any engineering field. Heat sinks are one of the most commonly used methods of dissipating heat away from sensitive components. The ATS-20C-29-C3-R0 is a heat sink that is constructed from Aluminum Alloy A-6063, with a dielectric coating applied. It is designed for high current applications and is suitable for a wide range of applications.
The ATS-20C-29-C3-R0 has a relatively large footprint compared to other heat sinks. This is primarily because of its large mass capacity, which is the amount of mass it can dissipate in order to heat up a given area. This means that the heat sink can efficiently dissipate heat from multiple components. The heat sink is equipped with a finned base, which increases the surface area for more efficient thermal dissipation. It also has an air gap, which is designed to increase air circulation and allow for better cooling.
The ATS-20C-29-C3-R0 has a copper heat spreader plate which helps to reduce surface temperature through a thermal spreader effect. This improves the overall temperature dissipation from multiple components. The copper heat spreader also helps to reduce the overall emissivity of the material, while also providing for improved heat conductivity.
In terms of performance, the ATS-20C-29-C3-R0 has been tested and proven to be capable of dissipating up to 2W/cm2 of thermal power. This is more than enough for most high current applications. The ATS-20 has been tested to temperatures up to 150°C without any negative effects on performance. The heat sink is designed to provide maximum thermally conductivity and to keep the temperature of the component below the dew point.
The ATS-20C-29-C3-R0 heat sink is suitable for a wide range of applications, including power supply, automotive, semiconductor, computer, and industrial applications. It is perfect for applications where heat dissipation and thermal management are needed. It is a reliable and waterproof heat sink that can be mounted for optimum performance. The heat sink can be used in a wide range of temperatures and can handle up to 2W of thermal power.
The ATS-20C-29-C3-R0 is a high-quality thermal management solution that is suitable for most thermal-related applications. It has been designed to withstand extreme temperatures and is capable of dissipating large amounts of heat effectively. It is a reliable, waterproof, and efficient heat sink that can be used in a wide range of environments and applications. The heat sink is also lightweight and easy to install.
The specific data is subject to PDF, and the above content is for reference