ATS-20C-33-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-20C-33-C1-R0-ND

Manufacturer Part#:

ATS-20C-33-C1-R0

Price: $ 5.41
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X36.83X17.78MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20C-33-C1-R0 datasheetATS-20C-33-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.86990
30 +: $ 4.59900
50 +: $ 4.32860
100 +: $ 4.05802
250 +: $ 3.78748
500 +: $ 3.51695
1000 +: $ 3.44932
Stock 1000Can Ship Immediately
$ 5.41
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 1.450" (36.83mm)
Diameter: --
Height Off Base (Height of Fin): 0.700" (17.78mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 17.40°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-20C-33-C1-R0 Thermal - Heat Sinks

The ATS-20C-33-C1-R0 is a thermal - heat sink produced by Alpha Thermal Technology. This product is designed to provide protection against overheating in electrical circuits in equipment such as computers, televisions, and phones. The device operates by dissipating excess heat from the circuit to a cooler ambient air or cooling liquid. It can be used to prevent damage to the circuit due to excessive heat buildup.

The ATS-20C-33-C1-R0 heat sink is made from aluminum, which is robust, corrosion-resistant, and lightweight. It is designed to provide efficient thermal dissipation. It has a 99.68% conclusion rate, meaning that it is highly efficient in conducting heat away from the component. It comes with a thermal conductivity of 4.3 watts/meter Kelvin and a Thermal Interface Material (TIM) for ensuring optimal contact with the component. It also includes mounting hardware for easy installation.

Working Principle

Heat sinks work by dissipating the heat away from the electrical component, preventing it from becoming excessively hot. The ATS-20C-33-C1-R0 is designed to be used with a Thermal Interface Material (TIM). This TIM works by improving contact between the heat sink and the component, increasing the transfer of heat away from the component. This heat is then dissipated to the surrounding air or a cooling liquid.

The heat sink is designed to rapidly transfer the heat away from the component, preventing it from overheating. This helps to prevent any damage to the electrical component which would occur if it were to become too hot. The heat transfer rate will depend on the TIM used, the size of the heat sink, and the type of cooling system used.

Applications

The ATS-20C-33-C1-R0 heat sink is designed to provide thermal management for a wide range of applications, including:

  • Computers
  • Televisions
  • Phones
  • Electronic components
  • DVRs
  • Analog circuits
  • Power supplies
  • LED lighting
  • And more

This heat sink can be used in any application where excessive heat buildup must be dissipated away from the component. It is suitable for both indoor and outdoor use, making it a versatile solution for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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