ATS-20C-35-C3-R0

ATS-20C-35-C3-R0 is a thermal – heat sink that is designed to provide thermal management to various components such as microprocessors, transistors, and other electronic devices. This heat sink combines the cooling efficiency of an aluminum fin stack with the rigid construction of a copper base and is able to dissipate approximately 35 watts under 150-cfm forced airflow. It offers a temperature range from -25°C to +125°C.

The ATS-20C-35-C3-R0 heat sink is typically used in applications that require compact, low profile, and reliable heat sinks. This type of heat sink can be found in a variety of applications, including medical, automotive, industrial, and aerospace. In addition, this heat sink is commonly used in applications requiring high heat transfer rates, since aluminum is one of the best thermal conductors among all metals. It is also highly efficient in radiating heat away from its source.

The ATS-20C-35-C3-R0 heat sink is designed with a combination of copper and aluminum for maximum thermal performance. Its copper base ensures that the thermal resistance at the base is as low as possible and increases heat transfer efficiency. The large aluminum fin stack is designed to maximize air circulation and increase surface area for heat dissipation. The fins are bent to increase turbulence in the airflow, allowing for maximum heat dissipation.

To provide optimal air-to-heat dissipation, the ATS-20C-35-C3-R0 heat sink uses an array of small holes drilled into the copper base to direct the airflow around the heat sink. This ensures that the heat is transferred away from the heat source quickly and efficiently. The heat sink also includes a plenum chamber, which is designed to increase pressure so that the air can pass around the heat sink more easily. This helps to provide higher levels of heat dissipation.

The ATS-20C-35-C3-R0 heat sink is designed to fit into tight spaces and comes in a range of sizes for easier installation. This heat sink is also designed to be tolerant to tolerances caused by tightening or loosening during installation. It can also be used in multiple applications, with no additional components required for installation.

In summary, the ATS-20C-35-C3-R0 is a thermal – heat sink designed for efficient heat transfer and air-to-heat dissipation. Its combination of copper base with an aluminum fin stack is ideal for the thermal management of electronic devices, delivering up to 35 watts of heat dissipation under 150-cfm forced airflow. This particular model is often used in a variety of applications, including medical, automotive, industrial, and aerospace applications. Its unique design also ensures that the heat is dissipated quickly and efficiently, providing optimal thermal performance.