ATS-20C-38-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.450" (36.83mm)
Width:	2.267" (57.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.900" (22.86mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.50°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

ATS-20C-38-C3-R0 is an efficient and reliable heat dissipation tool designed and manufactured by Advanced Thermal Solutions, Inc. It is a thermal-heat sink that is used in various applications in the industry. This article will discuss the application fields and principles behind the ATS-20C-38-C3-R0 thermal-heat sink.

Application Field

ATS-20C-38-C3-R0 thermal-heat sink is used in electronic components and systems, including CPUs, GPUs, system components, sensors, boards and others. Moreover, it is suitable for cooling applications such as power modules, automotive, LED lighting and telecommunications, which generate large amounts of heat when in operation.

Work Principle

ATS-20C-38-C3-R0 thermal-heat sink works by using a process of using a metal to absorb the heat from the component or system and then conduct the heat away via heat conduction of the metal. This process is aided by the increase in surface area of the heat sink, which allows more conduction of the heat away from the component and system.The heat sink is made out of aluminum or copper, which is an excellent heat conductor as well as being lightweight and has a good thermal conductivity. The heat sink has a flat base for a strong thermal contact with the components, and it also has fins to increase the surface area and help dissipate the heat more easily. In addition, the heat sink also has an embedded fan to further improve the performance of thermal heat dissipation.

Conclusion

ATS-20C-38-C3-R0 thermal-heat sink is a great tool for managing heat in various electronic components and systems. It is lightweight and reliable, with an increase in surface area to help dissipate the heat more easily. The embedded fan also aids in increasing performance of thermal heat dissipation. This tool is suitable for various applications and is an excellent option for cooling electronic components.

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