ATS-20C-48-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20C-48-C3-R0-ND

Manufacturer Part#:

ATS-20C-48-C3-R0

Price: $ 3.82
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X35MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20C-48-C3-R0 datasheetATS-20C-48-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.47004
30 +: $ 3.27726
50 +: $ 3.08448
100 +: $ 2.89170
250 +: $ 2.69892
500 +: $ 2.50614
1000 +: $ 2.45794
Stock 1000Can Ship Immediately
$ 3.82
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.78°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-20C-48-C3-R0 application field and working principle

Thermal – Heat Sinks are components that absorb and dissapate heat in order to regulate temperature and prevent a range of related problems occuring. The ATS-20C-48-C3-R0 is a fanless and heatsink-designed thermoelectric air-conditioning (TEC) module designed for cooling equipment where reliable and efficient cooling power is essential. Providing notable cooling power and rugged construction, the ATS-20C-48-C3-R0 reliably cools its environment while providing silent, vibration-free operation.

The ATS-20C-48-C3-R0 uses a fanless design which combines a flat aluminum heatsink with a compact TEC module. The combination of these two components results in a highly effective heat transfer which can still provide effective cooling power even in a low airflow environment. This makes it suitable for a range of applications where airflow may be limited, such as industrial installations.

The ATS-20C-48-C3-R0’s TEC module runs at 48 Volts DC and can deliver 3.3 Watts of cooling power. The module operates by having two semiconductor chips that are separated by a metallic material, creating a thermoelectric junction. When power is supplied to the TEC module, an electric current is created which causes heat to transfer from one side of the chip to the other. This process is reversed when the power is cut off, allowing the module to cool down quickly and efficiently.

The heatsink of the ATS-20C-48-C3-R0 is made up of an extruded aluminum body with a black finish. This aluminum body helps to dissipate the heat from the thermoelectric junction to the outside environment in an efficient manner. The aluminum also acts as a protective barrier which makes the module resistant to vibration and shock.

The ATS-20C-48-C3-R0 has a wide range of applications, including industrial cooling, telecom switching rooms, data centers, medical MRI consoles, and more. It is designed to provide maximum cooling power in both demanding and confined environments, making it a reliable cooling solution for a range of industries and applications.

The ATS-20C-48-C3-R0 is a reliable and effective thermal solution designed for use in a range of applications. Utilizing a fanless design combined with a compact thermoelectric module, the ATS-20C-48-C3-R0 is able to provide efficient cooling power even in a low airflow environment. This makes it suitable for a variety of industrial cooling needs.

The specific data is subject to PDF, and the above content is for reference

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