| Allicdata Part #: | ATS-20C-50-C3-R0-ND |
| Manufacturer Part#: |
ATS-20C-50-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-50-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an important component in a wide variety of electronic devices and systems. The ATS-20C-50-C3-R0 is a thermal-heat sink designed to provide uniform heat dissipation across an exceptionally wide range of temperature ranges. This unit is an ideal choice for applications that require superior cooling performance and reliability in both medium and large-scale formats. This comprehensive guide will discuss the application field and working principle of the ATS-20C-50-C3-R0, providing an overview of the key features and advantages that this unit brings to any system.
Application Field
The ATS-20C-50-C3-R0 is suitable for a range of different applications, from industrial and consumer electronics to medical and military equipment. It can be utilized in the cooling of power supplies, CPUs and GPUs, as well as being suitable for various types of HVAC systems. The large-scale design of the unit ensures that it can be used in applications where large amounts of heat must be managed efficiently, making it a great choice for environments where space is at a premium.
The unit is also suitable for use in computers, networks and telecommunications systems, providing direct point-to-point cooling for CPUs, GPUs and other heat-sensitive components. This unit is designed with high-efficiency in mind and is capable of withstanding both short duration and long-term overloads without undue temperature stress.
Working Principle
The ATS-20C-50-C3-R0 is designed to dissipate heat across its entire surface area. This is achieved with the use of advanced technology, such as the presence of a highly efficient heat conduction path and dispersing fins that are designed to act as a dynamic heat sink. This ensures that the heat generated by components on the surface of the unit is spread evenly and efficiently, resulting in lower levels of temperature stress. Additionally, the ATS-20C-50-C3-R0 is designed to be extremely lightweight and has low installation costs, making it suitable for a range of different application environments.
This thermal-heat sink is also designed with noise reduction in mind, with its internal design allowing it to absorb noise generated by the operating devices and distribute it more evenly across its surface. This reduces the amount of disturbance that can be created within an environment, which makes it useful for applications where noise can be an issue.
Overall, the ATS-20C-50-C3-R0 is an excellent choice for any application that requires superior cooling performance and reliability over an exceptionally wide range of temperature ranges. This unit is designed with high-efficiency in mind and capable of withstanding both short duration and long-term overloads without undue temperature stress. It is lightweight, low-cost and highly efficient, making it an ideal choice for any environment where thermal-heat sinks are an essential component.
The specific data is subject to PDF, and the above content is for reference