| Allicdata Part #: | ATS-20C-52-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-52-C1-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-52-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.10275 |
| 30 +: | $ 3.01896 |
| 50 +: | $ 2.85125 |
| 100 +: | $ 2.68349 |
| 250 +: | $ 2.51579 |
| 500 +: | $ 2.43193 |
| 1000 +: | $ 2.18034 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.74°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential in solving many technical challenges, especially in the electronics industry. The ATS-20C-52-C1-R0 heat sink is a highly effective cooling solution that can be utilized in several applications. This product utilizes a natural convection air-cooling process to dissipate heat generated by integrated circuits. It also has several features, such as low thermal resistance and high mounting strength, that make it ideal for numerous critical tasks.
The ATS-20C-52-C1-R0 is particularly useful in heavily-packed electronics applications where the dissipated heat must quickly and effectively be removed. The heat sink is designed to provide the adequate thermal resistance for adequate surface contact between the heat sink bodies and the integrated circuit devices. Thus, the product is an ideal choice for applications where heat must be effectively transferred away from the devices while still allowing for efficient air cooling. This is especially important in electronics applications where there is limited space due to the need for higher thermal transfer efficiency.
The ATS-20C-52-C1-R0\'s thermal resistance is also exceptional. It is rated to handle temperatures up to 135 degrees Celsius, with a maximum thermal resistance of 0.7 K/W. This ensures that the heat dissipated by the device is effectively removed from the electronic components. Additionally, the product features a high mounting strength that is designed to resist deformation even under lengthy and elevated temperatures. This ensures that the system can operate effectively for long periods of time.
The ATS-20C-52-C1-R0\'s working principle is based on its natural convection cooling process. This system utilizes natural air convection to draw away heat from the integrated circuit devices by creating an air pocket between the heat sink bodies and the PCB surface. This process helps to reduce the temperature of the integrated devices, thus preventing them from overheating and damaging other components on the board.
In conclusion, the ATS-20C-52-C1-R0 heat sink is an ideal choice for electronics applications where there is a need for a highly efficient yet cost-effective cooling solution. It is designed to offer excellent thermal resistance and high mounting strength, thus making it an ideal choice for heavily-packed electronics. Furthermore, its natural convection air-cooling process ensures that the dissipated heat is quickly and effectively removed from the components. This ensures that the system can operate effectively and efficiently for long periods of time.
The specific data is subject to PDF, and the above content is for reference