| Allicdata Part #: | ATS33307-ND |
| Manufacturer Part#: |
ATS-20C-76-C2-R0 |
| Price: | $ 3.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-76-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.30750 |
| 10 +: | $ 3.22182 |
| 25 +: | $ 3.13463 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.57°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for ensuring safe and efficient operation in electronic devices. Heat sinks are used to dissipate heat from these devices, and ATS-20C-76-C2-R0 is a specified type of heat sink. Heat sinks provide enhanced thermal conductivity, superior cooling, and allow improved air flow. This paper will explain the application field and working principle of the ATS-20C-76-C2-R0 heat sink.
The application field of the ATS-20C-76-C2-R0 heat sink includes a wide variety of electronic components such as CPUs, GPUs, hard drives, and power amplifiers. This heat sink is designed to improve the cooling efficiency of electronic components when they are operating under high thermal demands. It works by dissipating heat away from the components and dispersing it into the surrounding environment. This allows the device to run at optimal temperatures and avoid thermal overload.
The working principle of the ATS-20C-76-C2-R0 heat sink is based on the concept of natural convection. When an electronic device is powered up, it produces heat, which will naturally rise into the atmosphere. The heat sink works by increasing the surface area that is exposed to the natural convection of air currents. This exposes the heated components to the air which absorbs and dissipates the heat.
The heat sink is designed with strategically placed heatsink fins which increase the surface area exposed to the air. Heat is conducted away from the components through the heat sink fins and dissipates into the air. To further improve cooling efficiency, these fins are designed to be optimally spaced for maximum heat dissipation. The total thermal resistance of the heat sink is minimized, allowing components to maintain optimal temperatures even under high thermal demands.
In addition, the ATS-20C-76-C2-R0 heat sink offers superior thermal stability due to its extended fin support. This allows components to remain at a steady temperature even under changing environmental conditions. The heat sink also ensures that components do not overheat and avoids the risk of thermal damage.
The ATS-20C-76-C2-R0 heat sink is an efficient and reliable choice for cooling electronic components under high heat loads. Its increased surface area exposed to the air, strategically placed fins, and extended fin support all contribute to its superior cooling efficiency. It is also highly stable, resistant to thermal damage, and provides improved air flow. All of these features make it an ideal choice for many electronic applications.
The specific data is subject to PDF, and the above content is for reference