ATS-20C-78-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.64°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sinks are devices usually used to transfer thermal energy away from hot components of electronic devices, like microprocessor chips, to prevent them from overheating. The ATS-20C-78-C1-R0 heat sink is a compact model designed to provide superior cooling and reliability throughout its operation.

Construction

The ATS-20C-78-C1-R0 heat sink is made of aluminum and features a standard fin design, which is designed for optimal heat transfer. Its fins are arranged in a staggered pattern and are spaced apart to provide maximum surface area for heat dissipation. Additionally, the heat sink is equipped with a forced-air cooling system. The fan is designed to efficiently move air over its fin surfaces, which reduces the overall system temperature.

Operation

Under normal operation, the ATS-20C-78-C1-R0 heat sink works by absorbing the heat produced by the component and transferring it to the surrounding air. This is done by conduction, convection, and radiation. The heat sink then dissipates the heat through its fin design, forcing it away from the component and out of the system. In addition, the fan helps circulate cool air across the fins, further cooling the system and preventing it from overheating.

Applications

The ATS-20C-78-C1-R0 heat sink is mainly used in electronics that generate high amounts of heat, such as computers, microprocessors, and other similar devices. It is also used in smaller electronic devices such as laptops and tablets. This heat sink is especially suited for applications where space is limited, as its compact design makes it ideal for tight spaces.

Advantages

The ATS-20C-78-C1-R0 heat sink offers several advantages over other thermal solutions. It is a light-weight solution that is easy to install and requires minimal maintenance. It also features low power consumption and provides efficient heat transfer and high levels of reliability. In addition, its compact design allows it to fit into tight spaces and provides an aesthetically pleasing look.

Conclusion

The ATS-20C-78-C1-R0 heat sink is an efficient and reliable thermal solution for electronics that generate high levels of heat. Its compact design allows for optimal cooling in tight spaces, while its low power consumption and easy installation make it an attractive option for users. Its high levels of reliability make it an ideal choice for all types of applications.

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