| Allicdata Part #: | ATS-20C-86-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-86-C1-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-86-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03156 |
| 30 +: | $ 2.94945 |
| 50 +: | $ 2.78573 |
| 100 +: | $ 2.62181 |
| 250 +: | $ 2.45796 |
| 500 +: | $ 2.37602 |
| 1000 +: | $ 2.13022 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is often the biggest concern for electronic applications. Many times, without proper thermal management, an application can quickly fail due to heat-induced issues. The Thermal-Heat Sinks is one of the ways that engineers can apply to generate efficient thermal management solutions by dissipating excess heat. In this article, we analyze the field of application and working principle of the ATS-20C-86-C1-R0.
The ATS-20C-86-C1-R0 Thermal-Heat Sink is primarily used with a wide variety of energy efficiency modules. It is used in applications such as LED lighting, industrial controllers, audio/video systems, and networking applications. It is designed to transfer the heat generated by energy-efficient modules to the surrounding environment, thus preventing the modules from overheating. It is also certified to meet stringent safety standards, making it suitable for both commercial and industrial applications.
The ATS-20C-86-C1-R0 Thermal-Heat Sink utilizes a unique finned-cooling technology. This technology is designed to help dissipate the heat more efficiently and quickly. The heat sink consists of an aluminum base and fins that are connected together by a type of rubber compound, which allows the fins to transfer heat away from the base. The aluminum base and the fins are designed together to provide a high level of thermal conductivity. The fins also help to increase the surface area, allowing more heat to be dissipated through convection.
The ATS-20C-86-C1-R0 Thermal-Heat Sink also features a two-piece design which allows for a more adjustable and flexible installation. The two-piece design also makes it easier to mount the device in tight or limited spaces. To attach the device, it must be correctly aligned with the energy efficiency module. This is done by using a fastening method, such as through bolts or rivets.
The ATS-20C-86-C1-R0 Thermal-Heat Sink utilizes a unique integrated heat dissipation technology. This technology is designed to work most efficiently by minimizing the number of turns required for the heat sinking material to reach the desired temperature level. The device itself is made of anodized aluminum, which helps to increase the level of efficiency, and also helps to minimize weight and improve thermal performance.
The ATS-20C-86-C1-R0 Thermal-Heat Sink is designed to be durable and reliable. It is also designed to be resistant to corrosion and has an expected lifespan of around 10 years. It is also easy to install and requires only basic maintenance.
Overall, the ATS-20C-86-C1-R0 Thermal-Heat Sink is designed to provide a high level of efficiency and thermal performance to a range of applications. It is also designed to be durable and reliable, making it ideal for both commercial and industrial applications. The device is also easy to install and require only basic maintenance and repair. And lastly, its two-piece design is also beneficial for more adjustable and flexible installations.
The specific data is subject to PDF, and the above content is for reference