ATS-20C-90-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.33°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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What is ATS-20C-90-C1-R0?

ATS-20C-90-C1-R0 is a thermal-heat sink, a device designed to dissipate heat created by active electronic components and circuits into the atmosphere. Thermal heat sinks are present in many electrical and electronic devices, such as computers, smartphones, and other relatively small consumer electronics.

Application Field of ATS-20C-90-C1-R0

ATS-20C-90-C1-R0 is intended for use in desktop PCs, servers and consumer electronics. It features a manufacturer-recommended mounting type compatible with the majority of personal computer motherboards and system boards. Its two-piece design ensures compatibility with most thermal management solutions, making it a great choice for any computing environment.It is also suitable for cooling power semiconductors, such as diodes, transistors, and voltage regulators in both commercial and industrial applications. Because of its low mass, ATS-20C-90-C1-R0 is especially suitable for applications where foreign materials are an issue, such as in factories and laboratories.

Working Principle of ATS-20C-90-C1-R0

The ATS-20C-90-C1-R0 uses a combination of convection, conduction, and radiation to remove heat from components.When electronic components generate energy, a portion of it is released as heat. In order to keep these components from overheating, that heat must be dissipated to the atmosphere. ATS-20C-90-C1-R0 does this by using three different cooling methods.The first is convection. Heat is transferred from the hot component to the air passing through the thermal-heat sink. The result is a lower temperature around the component and a higher temperature in the air that escapes the thermal-heat sink.The second mechanism is conduction. Heat is transferred from the component to the thermal-heat sink itself through metal-to-metal contact. This connection allows the heat to spread rapidly throughout the thermal-heat sink, distributing the heat evenly and dissipating it to the atmosphere.Finally, radiation is used to disperse the large amounts of energy in the air around the device. This radiation cools the component and the air around it, further reducing the temperature gradient and improving cooling efficiency.

Conclusion

The ATS-20C-90-C1-R0 thermal-heat sink combines convection, conduction, and radiation to provide effective cooling of personal computers, servers, consumer electronics, and other electrical components. Its two-piece design ensures compatibility with most thermal management solutions, making it an ideal choice for any computing environment.

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