| Allicdata Part #: | ATS-20C-93-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-93-C1-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-93-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks, such as the ATS-20C-93-C1-R0, are devices used to effectively dissipate heat from electronic components. They are typically composed of a metal or plastic base with aluminum fins attached to it. Heat generated by components such as computer chips, transistors, or power supplies is conducted through the base and fins of a heat sink. The fins act as heat sinks, dissipating the heat into the surrounding air. This helps keep components cool, preventing them from overheating and malfunctioning.
The ATS-20C-93-C1-R0 is a special type of thermal heat sink that offers an optimized design for the highest level of efficiency and performance. It is designed to cool electronic components with higher power needs. It features a unique design to provide good thermal transfer performance and a low profile which helps reduce the overall size of the system. It has multiple aluminum fins that are soldered to a copper base and has an intergrated fan design to increase air flow. In addition, the ATS-20C-93-C1-R0 also features a high-temperature epoxy coating that helps protect the components from dust and other contaminants.
The ATS-20C-93-C1-R0 is a high-performance heat sink that is suitable for a wide range of applications. It is often used in high-power systems such as gaming PCs, servers, and other industrial equipment. It is also used in a variety of consumer electronic devices such as laptops, desktop computers, smartphones, and other digital equipment. This heat sink is designed to provide efficient heat dissipation while maintaining the highest possible level of performance and reliability.
The working principle of a thermal heat sink is based on the idea of thermal conductivity. Heat is conducted from the component to the heat sink body by conduction. Then, the heat is dispersed throughout the fins of the heat sink by convection and radiation. This process helps draw the heat away from the component and dissipate it into the surrounding air. The ATS-20C-93-C1-R0 heat sink is designed to provide maximum heat dissipation while still maintaining the highest possible performance levels.
The ATS-20C-93-C1-R0 thermal heat sink is an efficient way to keep your system running at its optimal performance level without sacrificing reliability. It has a unique design to provide maximum heat dissipation, and the integrated fan design helps ensure air flow is not blocked or restricted. The epoxy coating also helps protect components from dust and other contaminants. The ATS-20C-93-C1-R0 can be used in a wide variety of applications, from industrial to consumer electronic devices, and is an excellent choice for anyone looking to get the most out of their system.
The specific data is subject to PDF, and the above content is for reference