| Allicdata Part #: | ATS-20C-97-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-97-C1-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-97-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-20C-97-C1-R0 is an example of thermal-heat sinks. Thermal-heat sinks are devices that conduct heat from a surface and dissipate it to the environment by transferring heat from a hot region or surface, usually via thermal radiation or convection. This product is designed to minimize the thermal resistance between surface contact areas to maximizing the amount of thermal energy that can transfer through from one area to another. It is also designed to reduce the temperature of the area gradually.
Application Field and Working Principle
ATS-20C-97-C1-R0 is widely used in many fields such as electronics, industrial machines, robots and medical equipment, etc. It is often used to cool down processors, GPUs and other components in computers and gaming systems. The heat sink is also used in applications such as high-power LEDs used in lighting and for industrial heating elements.
The working principle of the ATS-20C-97-C1-R0 is thermal conduction. It helps to reduce the temperature of a room by conducting the heat away from the surface on which it is direct contact. This is done by transferring the thermal energy from the hot region to the cooler environment. The heat sink consists of a finned metal structure which is integrated with a heat pipe. The heat pipe carries heat away from the device, while the fins serve to increase the surface area for better heat dissipation.
The ATS-20C-97-C1-R0 can be installed with screws or adhesive tape. It comes with mounting hardware allowing it to be easily installed and removed for easy maintenance. Once installed, the thermal pad in the heat sink will act to absorb the heat emitted from the components and the heat pipe will be responsible for dissipating the heat into the environment. This helps to reduce the overall temperature in the room as well as the temperature of the components the heat sink is in contact with.
Conclusion
The ATS-20C-97-C1-R0 is designed to be a cost effective yet powerful heat sink solution for many applications. It is designed to minimize thermal resistance and maximize heat transfer, while also providing a lower temperature gradually. It is suitable for use in many fields such as electronics, industrial machines, robots and medical equipment and is also suitable for cooling down processors, GPUs and other components in computers and gaming systems. This product provides a convenient and cost-effective way to reduce the temperature of any introduced environment.
The specific data is subject to PDF, and the above content is for reference