
Allicdata Part #: | ATS33340-ND |
Manufacturer Part#: |
ATS-20D-10-C2-R0 |
Price: | $ 4.19 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X25MM XCUT T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 3.80520 |
10 +: | $ 3.70125 |
25 +: | $ 3.49574 |
50 +: | $ 3.29011 |
100 +: | $ 3.08448 |
250 +: | $ 2.87885 |
500 +: | $ 2.67322 |
1000 +: | $ 2.62181 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.89°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important technology in modern computing and electronics today. Heat sinks, particularly those used in cooling high power applications, are essential pieces of equipment for prolonging the life of electronic components and dissipating heat. The ATS-20D-10-C2-R0 is an advanced thermal management solution that is designed to provide superior cooling performance in a range of applications.
The ATS-20D-10-C2-R0 is a high performance heat sink designed to provide superior thermal dissipation capabilities in applications requiring significant levels of power. This heat sink utilizes a dual-layer design, allowing it to dissipate heat more quickly and efficiently than single-layer heat sinks. These layers are optimized to provide optimal efficiency in different environments. The base of the heat sink is made of a thin aluminum plate, and the top layer is made of a ceramic based layer.
The ATS-20D-10-C2-R0 has an innovative fin design which allows it to provide superior heat dissipation capabilities in a range of different application settings. The fin design utilizes multiple pin-fins which direct the air flow against the heat sink more effectively and efficiently than traditional fin designs. The pin-fins also help to keep the heat sink from becoming blocked by dust and debris, allowing it to continue performing at its highest efficiencies.
The ATS-20D-10-C2-R0 is a highly reliable heat sink and is capable of dissipating heat in applications with temperatures of up to 100°C. This heat sink can also be used in a variety of applications involving high power and high heat load computing systems. It can be used in areas such as servers, workstations, gaming systems, as well as industrial control equipment.
In addition to its superior heat dissipation capabilities, the ATS-20D-10-C2-R0 has several other features which make it an ideal choice for a wide range of applications. It is highly resistant to oxidation and corrosion, making it a long-lasting and reliable thermal management solution. The heat sink also includes a heatsink frame which provides additional support for the cooling fins and assist in the proper installation of the heat sink.
The ATS-20D-10-C2-R0 also features a built-in fan for further cooling capability. This fan can be mounted on the top of the heat sink and is designed to direct air away from the heat sink fins in order to maximize heat dissipation. Additionally, the fan can be adjusted manually or remotely in order to optimize the cooling for different environments.
Overall, the ATS-20D-10-C2-R0 is an advanced thermal management solution with superior heat dissipation capabilities. It is highly reliable, feature-rich, and easy to install. With its advanced fin design, fan, and corrosion-resistant construction, the ATS-20D-10-C2-R0 is an ideal choice for a wide range of applications in need of superior cooling performance.
The specific data is subject to PDF, and the above content is for reference