| Allicdata Part #: | ATS-20D-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-20D-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20D-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-20D-117-C1-R0 Thermal Heat Sink is an essential component in cooling applications, which utilise its outstanding ability to protect against overheating.
This heat sink type is known for its strong durability and efficiency in dissipating heat away from delicate components, allowing them to remain cool and operate safely. It is popular in many applications and is commonly found in computers, laptops, and consumer electronics.
The ATS-20D-117-C1-R0 has two main parts: the body and the fins. The body accounts for a majority of the heat sink’s construction, with a metal base plate and supporting arms to provide a strong structure. The aluminum fins extend from the top of the heat sink and act as additional heat exchangers. By expanding the surface area, these fins increase the heat dissipation over the adjacent surfaces of the heat sink.
The operating principle of the ATS-20D-117-C1-R0 is based on a two-step process. First, the heat is conducted from the heat-generating component into the heat sink body. Then, the heat is dissipated into the surrounding air by convection, where it naturally dissipates and keeps the component cool. Alternatively, a fan can be used to rapidly drive the hot air away from the heat sink, resulting in an optimal cooling system.
Due to its low-profile design and uniform surface area, the ATS-20D-117-C1-R0 is an ideal choice for applications such as servers, medical electronics, and avionics. It is also suitable for in high-temperature applications while providing reliable and consistent performance.
As a method of passive cooling, heat sink devices are essential components in many consumer electronics and technological products. Not only do they provide critical protection against overheating and their integral importance cannot be overstated. In the case of the ATS-20D-117-C1-R0 in particular, its high quality and efficiency make it an ideal choice for a variety of applications.
The specific data is subject to PDF, and the above content is for reference