| Allicdata Part #: | ATS-20D-13-C3-R0-ND |
| Manufacturer Part#: |
ATS-20D-13-C3-R0 |
| Price: | $ 4.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20D-13-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.63195 |
| 30 +: | $ 3.43014 |
| 50 +: | $ 3.22837 |
| 100 +: | $ 3.02665 |
| 250 +: | $ 2.82487 |
| 500 +: | $ 2.62310 |
| 1000 +: | $ 2.57265 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are devices that are used to efficiently dissipate large amounts of heat away from a component or system. ATS-20D-13-C3-R0 is a heat sink specifically designed to dissipate heat away from components in an efficient and effective manner. This article will explore the application field and working principle of ATS-20D-13-C3-R0.
Application Field
ATS-20D-13-C3-R0 heat sink is mainly used in computer processors, graphics cards, power amplifiers, laser diodes, and other components that generate large amounts of heat. The component should be able to withstand a maximum temperature of 260°C. Additionally, ATS-20D-13-C3-R0 has a wide range of compatibility when it comes to other components such as WiFi cards, storage drives, SIM card modules, optical modules, and other microelectronic components.
Working Principle
ATS-20D-13-C3-R0 works on the principle of heat dissipation. The heat sink is designed to absorb heat from components and then dissipate it outwards. Heat sinks usually contain multiple fins that are designed to help increase the surface area, so that the maximum amount of heat can be absorbed. Additionally, some heat sinks also contain fans that create airflows to increase the effectiveness of the dissipation.
The base of the heat sink is made of aluminum or copper and it is usually in direct contact with the component that requires cooling. Heat can be transferred from the component to the heat sink by either conduction or convection. In conduction, the heat is transferred through direct contact between the component and the heat sink. In convection, the heat is transferred through the air between the components and the heat sink.
Conclusion
ATS-20D-13-C3-R0 is a heat sink specifically designed to dissipate heat away from components in an efficient and effective manner. It is used in computer processors, graphics cards, power amplifiers, laser diodes, and other components that generate large amounts of heat. The heat sink works on the principle of heat dissipation, which involves using multiple fins and concepts such as conduction and convection. Heat sinks are essential components in any system that generates a lot of heat and they help to ensure that the components maintain their stability under high temperatures.
The specific data is subject to PDF, and the above content is for reference