| Allicdata Part #: | ATS33375-ND |
| Manufacturer Part#: |
ATS-20D-131-C2-R0 |
| Price: | $ 5.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20D-131-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.05260 |
| 10 +: | $ 4.91589 |
| 25 +: | $ 4.64285 |
| 50 +: | $ 4.36968 |
| 100 +: | $ 4.09658 |
| 250 +: | $ 3.82347 |
| 500 +: | $ 3.55036 |
| 1000 +: | $ 3.48209 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-20D-131-C2-R0 is a parts belonging to the Thermal - Heat Sinksgroup. This particular part, when used correctly, is capable of providing efficient cooling of any electronic device or system that needs it. This article aims to explore the application field of the ATS-20D-131-C2-R0, as well as how the device works to achieve its cooling capability.
When it comes to the application field of the ATS-20D-131-C2-R0, thermal and heat sinks can be used to dissipate heat from various components. Their ideal application is in computers, and other delicate electronic devices that generate a large amount of heat when in operation. Other areas include LED lighting and telecommunications, which require active device cooling.
The ATS-20D-131-C2-R0 is designed to efficiently cool down any electronic components. The part is made up of two key components. The first is an extruded aluminum block which is capable of heat dissipation through its surface area. The second component is a fan that is mounted on the block and is responsible for moving the heat away from the component and into the surrounding air.
The process of heat dissipation starts when the fan is switched on. The fan begins to draw the warm air away from the component and into the heatsink. As the warm air is moved through the heatsink, it is slowly cooled by the aluminum fins that are part of the heatsink. The cooled air is then pushed outside through a set of vents, allowing the component to remain cool.
Once the heat has been successfully removed from the component, the electronic device will not overheat, and it will be able to maintain optimal performance levels. This is all possible through the efficient cooling provided by the ATS-20D-131-C2-R0.
However, there are other considerations to take into account when choosing a thermal and heat sink. Not only does it need to be designed with extra surface area to dissipate a larger amount of heat, but the efficiency of the cooling device will depend on the fan size, the airflow rate, and the types of aluminum fins used. All of these factors need to be taken into account to ensure the highest efficiency possible.
In conclusion, the ATS-20D-131-C2-R0 is a highly effective thermal and heat sink that can be used to successfully cool down electronic components and systems. Its main applications are in computers and other delicate electronic devices that generate a large amount of heat when in operation. As with any device, it is important to take into consideration the fan size, airflow rate, and types of aluminum fins used to ensure optimum performance and efficiency.
The specific data is subject to PDF, and the above content is for reference