ATS-20D-156-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.14°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-20D-156-C2-R0 Thermal - Heat Sinks Application Field and Working Principle

Thermal - Heat Sinks are used to transfer heat from a component or device, usually in electronics, to another component or material that can absorb or dissipate the heat more effectively. Heat sinks are necessary in order to keep components from getting too hot and experiencing thermal runaways, which can ultimately cause component damage. The ATS-20D-156-C2-R0 is a thermal-heat sink, developed specifically to provide maximum cooling in extreme environments.The ATS-20D-156-C2-R0 is designed to maximize the performance of thermal management systems in devices and components operating in large temperature variance scenarios. Its high thermal conductivity, superior heat dissipation, and air-cooling capabilities provide efficient temperature control for applications where cooling is necessary. This type of heat sink is used for a range of thermal management applications, including storage devices, mobile phones, and even high-performance computing machines.The ATS-20D-156-C2-R0 relies on air-cooling to dissipate heat. The heat sink consists of an aluminum base and fins, as well as copper or aluminum heat pipe sections that allow heat to be transferred away from the component under cooling. The fins are arranged in grooves on the surface of the heat sink, providing an efficient heat transfer and better airflow distribution. Furthermore, the fins can be customized to fit into various components inside the device, allowing for accurate heat transfer.When used in an electronic device, the ATS-20D-156-C2-R0 effectively dissipates heat away from the components and board, reducing the chance of a thermal runaway occurring. The fins are carefully designed and calculated for efficient heat dissipation, but they provide maximum cooling by the effective design of the air guider, fan, and other features. In order for the thermal heat sink to work effectively, the fan must be placed in such a way that it can adequately move air around the components and fins.The ATS-20D-156-C2-R0 also features an adjustable airflow monitor, which allows users to control the cooling performance of the device. This monitor allows the user to adjust the airflow settings for specific applications, ensuring the device has the correct amount of airflow for optimal cooling. This adjustable airflow helps prolong the life of the device and prevents overheating.The ATS-20D-156-C2-R0 is equipped with an aerodynamic low-noise fan with a maximum speed of 1,800rpm. This fan is designed to provide maximum cooling without adding too much noise, and it is designed to ensure no vibration is transferred to the component inside the device. Furthermore, the fan is designed to be reliable, with a minimum operating life expectancy of 80,000 hours based on an IBM-certified ambient temperature. The ATS-20D-156-C2-R0 is a great choice for cooling components in high-performance computing applications. It is also designed to fit in various devices and components, ensuring maximum cooling performance at a low cost. In addition, the aerodynamic low-noise fan ensures that the device remains quiet, enabling users to enjoy their computing experience without worrying about excessive noise.

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