| Allicdata Part #: | ATS-20D-159-C1-R0-ND |
| Manufacturer Part#: |
ATS-20D-159-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20D-159-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-20D-159-C1-R0 Thermal - Heat Sink is an essential component in many industrial applications. It is designed to provide efficient heat dissipation from electrical and electronic components. The ATS-20D-159-C1-R0 Thermal - Heat Sink consists of a solid metal base which is connected to a dissipating plate. The dissipating plate is made from anodised aluminium and is fitted with a finned shape. This shape increases the air-flow rate around the cooling fins which results in enhanced cooling performance.
The ATS-20D-159-C1-R0 Thermal - Heat Sink is typically employed in applications requiring protection from electrical and electronic components\' elevated temperatures. This is achieved by dissipating the heat from the device by transferring it into the atmosphere. It can be used in applications such as high powered processors, servers, and other electronic systems in which frequent and effective cooling is required.
The ATS-20D-159-C1-R0 Thermal - Heat Sink is designed with a unique combination of a thermally efficient base plate, integrally moulded fins, and thermally conductive metal contact points. This ensures that the heat is efficiently conducted away from delicate components. The ATS-20D-159-C1-R0 Thermal - Heat Sink is available in a variety of sizes to accommodate different applications. It is also compatible with most modern electronic components.
When used in the right application, the ATS-20D-159-C1-R0 Thermal - Heat Sink offers several advantages. Firstly, the anodised aluminium fins provide excellent heat absorption capacity. This ensures that the heat from the electronic components dissipates quickly and efficiently. Secondly, the air-flow is well managed which ensures that the air-flow does not become obstructed or blocked, thus allowing for optimal cooling performance. Thirdly, the ATS-20D-159-C1-R0 Thermal - Heat Sink is compatible with most modern electronic components. This ensures that the heat sink can be used in a variety of different applications.
In addition, the ATS-20D-159-C1-R0 Thermal - Heat Sink is designed to be extremely easy to install. This ensures that applications are able to install the thermal - heat sink quickly and efficiently and with minimal need for additional tools. Finally, the ATS-20D-159-C1-R0 Thermal - Heat Sink has an aesthetically appealing look that is suitable for a variety of industrial applications.
In summary, the ATS-20D-159-C1-R0 Thermal - Heat Sink is an essential component in many industrial applications and offers an efficient and effective means of dissipating heat from electrical and electronic components. It is designed to be thermally efficient, air-flow managed, compatible with most modern components and easy to install. In addition, the ATS-20D-159-C1-R0 Thermal - Heat Sink offers an aesthetically pleasing look that suits a variety of industrial applications.
The specific data is subject to PDF, and the above content is for reference