| Allicdata Part #: | ATS-20D-159-C3-R0-ND |
| Manufacturer Part#: |
ATS-20D-159-C3-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20D-159-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.79386 |
| 30 +: | $ 3.58323 |
| 50 +: | $ 3.37239 |
| 100 +: | $ 3.16159 |
| 250 +: | $ 2.95082 |
| 500 +: | $ 2.74005 |
| 1000 +: | $ 2.68736 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal or heat sinks are an essential component in many electronic devices and appliances. Most electronic appliances and devices generate a certain amount of heat during operation, and high temperatures can cause serious damage to delicate circuits. Heat sinks are used to divert the heat from these devices and dissipate it out into the environment, keeping the device cool and operating efficiently.
The ATS-20D-159-C3-R0 is a highly efficient thermal-heat sink designed to cope with the higher heat production of many modern-day electronic devices and appliances. The sophisticated design of the sink maximizes its thermal conductivity for maximum heat dissipation. The device consists of a solid metal frame that houses a large set of fins, made from copper or aluminum. The aluminum fins work to dissipate the heat from the device, while the frame helps to contain the heat within the fins.
The ATS-20D-159-C3-R0 has a number of applications in the electronics industry, among them are high power LEDs, semiconductor devices, and CPUs in computers. The device is also widely used in industrial heating systems, and is even used in some aircraft and automotive applications. The ATS-20D-159-C3-R0 is highly efficient and can dissipate heat from devices with high power requirements, such as CPUs, at a remarkably fast rate.
The ATS-20D-159-C3-R0 works by using the frame to contain and direct the heat from the electronic device and onto the fins. The fins contain heat pipes, which are constructed from highly thermally conductive metals such as copper or aluminum, and the heat pipes are designed to direct the heat towards the fins. The fins contain a vapor chamber which absorbs the heat from the device and dissipates it out into the environment. This helps to keep the device from overheating and allows it to maintain peak performance.
The ATS-20D-159-C3-R0 is a highly efficient thermal-heat sink designed for the increasingly demanding power requirements of many modern electronic devices. It is used in a number of different industries, including industrial heating systems, aircraft and automotive applications. The device is highly effective at dissipating heat from electronic devices with high power requirements, such as CPUs, and its sophisticated design maximizes its thermal conductivity for maximum heat dissipation.
The specific data is subject to PDF, and the above content is for reference