ATS-20D-169-C3-R0

Thermal - Heat Sinks

Thermal management of electronics components is an important consideration for product design and manufacturing. Heat sinks are one of the main components of a thermal management system. A heat sink is a passive heat exchanger that transfers the energy of objects with higher temperature to objects with lower temperature. Heat sinks are used to cool objects, components, and systems that dissipate heat. Heat sinks have become increasingly important with the advancement of technology, high-power electronics, and modern industrial processes.

The ATS-20D-169-C3-R0 is a heat sink with a solid copper base and a fin assembly made from copper-clad aluminum. The device is designed to be used in high-current applications and is suitable for controlling the heat generated by power converters and cooling LED lighting systems. It is a highly efficient heat sink with a fin area of 169cm2, providing low thermal resistance and a maximum ambient operating temperature of +85℃.

Working Principle

Heat sinks work by transferring the heat generated by components or systems to a larger area of material with a higher thermal capacity. The heat dissipates at the larger surface area and results in lowered temperatures. ATS-20D-169-C3-R0 heat sink works by relying on the principles of convection and forced convection to reroute the heat away from the component. It uses the fin design to facilitate faster air movement, which helps conduct heat away from the component faster.

The design of the ATS-20D-169-C3-R0 also allows for larger surface area, which helps dissipate more heat more efficiently. The copper and aluminum bodies of this device actively wick heat away from the component being cooled, so it can be moved away as quickly and efficiently as possible. The fins act as a heat exchanger, dissipating heat into the air around the heat sink.

Application Field

The ATS-20D-169-C3-R0 heat sink is a high-performance device designed for use in extreme condition and is suitable for applications requiring high current load management and cooling. It is suitable for use in multiple types of devices, such as LED lighting systems, high-power electronics, and batteries. This device is a cost-effective solution for controlling temperatures in systems that are subjected to high temperature operating environments and require efficient heat sink properties.

The ATS-20D-169-C3-R0 is also suitable for thermal management in high-power PCBs and video cards as it efficiently dissipates the heat generated by these components. Additionally, this device can be used in medical imaging machines and other applications requiring thermal management. It is a reliable, efficient, and cost-effective solution for controlling temperatures in demanding applications.