| Allicdata Part #: | ATS-20D-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-20D-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20D-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-20D-173-C1-R0 is a thermal-heat sink designed to help dissipate the heat generated by electronic components. It is an aluminium extrusion heat sink, designed to provide a cost-effective solution for cooling devices in a wide range of industries and applications. The design combines stamped fins and extruded pillars to create a low-profile, thermally efficient heat sink with excellent thermal performance.
The extrusion heat sink has a number of benefits, such as low thermal resistance, high heat dissipation and low contact resistance. This makes it suitable for a wide range of applications, ranging from high power electronics to low power consumer electronics. It can also be used in high temperature applications such as LED lighting fixtures and consumer appliances.
The ATS-20D-173-C1-R0 is designed to maximize the heat transfer efficiency between the heat sink and the device it is cooling. The design features high surface area and thermal conductivity through its fin design, as well as low thermal resistance due to its low profile and direct flow path. This makes it particularly effective in high current situations, where rapid cooling needs to be achieved.
The heat sink is also designed to perform in accordance with EIA standards of reliability and durability. It is made from high strength aluminium alloy, which provides excellent strength, excellent corrosion resistance and excellent thermal performance. The alloy has also been carefully designed to prevent fatigue and keep the heat sink performing efficiently over time.
The ATS-20D-173-C1-R0 is widely used in computer systems, telecommunications, consumer electronics and other high-tech industries. It is a highly efficient heat sink, providing reliable cooling performance for a variety of applications. It is a cost-effective solution for cooling devices and is also easy to install and maintain.
In addition to its thermal properties, the ATS-20D-173-C1-R0 also has excellent electromagnetic shielding properties. This ensures that electromagnetic interference is kept to a minimum, providing superior performance in critical installations. The heat sink has been tested to international standards and meets all relevant safety requirements.
The ATS-20D-173-C1-R0 is a versatile and reliable thermal-heat sink solution for a wide range of applications. Its design and high quality components ensure superior performance and reliability, while its low cost makes it an ideal choice for cooling devices in a range of industries. With its outstanding performance and low cost, the ATS-20D-173-C1-R0 is a must-have for anyone looking for a reliable thermal-heat sink solution.
The specific data is subject to PDF, and the above content is for reference