| Allicdata Part #: | ATS33439-ND |
| Manufacturer Part#: |
ATS-20D-19-C2-R0 |
| Price: | $ 4.80 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20D-19-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.36590 |
| 10 +: | $ 4.24494 |
| 25 +: | $ 4.00907 |
| 50 +: | $ 3.77332 |
| 100 +: | $ 3.53751 |
| 250 +: | $ 3.30168 |
| 500 +: | $ 3.06585 |
| 1000 +: | $ 3.00689 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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As cooling solutions become more important as technology develops, thermal and heat sinks are used in more and more applications. The ATS-20D-19-C2-R0 is an example of a thermal-heat sink that provides effective performance in a variety of settings. To understand what this product can do, it’s important to look at its application field and working principle.
One area in which the ATS-20D-19-C2-R0 is often used is in power electronics. It is used to passively cool integrated circuit (IC) packages, particularly those that dissipate high amounts of heat. Power components are especially sensitive to temperature, and it is necessary to use a cooling solution that is reliable and effective for many years of use. This is where the ATS-20D-19-C2-R0 comes in. It is highly effective at dissipating heat away from the IC package, preventing thermal damage from occuring while also extending the life of the IC.
The ATS-20D-19-C2-R0 is also suitable for high-temperature applications, such as those found in medical electronics, where reliable performance is essential. Temperatures can reach up to 150°C, and the product manages to successfully cool the components while still offering the same level of performance and reliability as in lower-temperature settings.
In addition to its practical applications, the ATS-20D-19-C2-R0 is also light and compact. It takes up minimal space in whatever installation it is used in and is relatively easy to install, allowing for quick setup and operation. This is especially beneficial for applications that require frequent reconfiguration or upgrades.
Of course, the ATS-20D-19-C2-R0 is an effective and reliable thermal-heat sink due to its working principle. The product uses a combination of forms to obtain maximum efficiency. First, the aluminum body is designed to dissipate heat quickly, coupled with convection-enhancing materials that allow air to pass through the sink. The heat is then funneled away from the IC package, spread across the body of the product where it can safely dissipate. Finally, fins are positioned on the surface of the sink which further increase the dissipation of heat.
In sum, the ATS-20D-19-C2-R0 is an effective thermal-heat sink designed for use on high-performance and temperature-sensitive IC packages. Its combination of form and working principle offer superior performance and reliability, even in the most challenging applications. Its light and compact design, coupled with quick installation, make it a valuable asset for many commercial and industrial applications.
The specific data is subject to PDF, and the above content is for reference