| Allicdata Part #: | ATS-20D-193-C1-R0-ND |
| Manufacturer Part#: |
ATS-20D-193-C1-R0 |
| Price: | $ 3.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X6MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20D-193-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.72223 |
| 30 +: | $ 2.64873 |
| 50 +: | $ 2.50160 |
| 100 +: | $ 2.35450 |
| 250 +: | $ 2.20735 |
| 500 +: | $ 2.13376 |
| 1000 +: | $ 1.91302 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-20D-193-C1-R0 heat sink is an efficient and reliable thermal management solution. It is a highly efficient module that can effectively reduce the temperature of components installed in it. The heat generated by the electronic components is spread over a large area, thus dissipating the heat efficiently across the entire module.
The ATS-20D-193-C1-R0 heat sink consists of a large metal heat dissipation plate and four heat sinks. The heat dissipation plate is made of an aluminum alloy which is resistant to corrosion and is highly efficient in heat-dissipating. The four heat sinks are connected to the heat dissipation plate with bolts. The heat dissipation plate and the four heat sinks are designed to create a strong air convection current within the system, allowing the heat to be evenly distributed over the heat sinks.
The ATS-20D-193-C1-R0 heat sink features an integrated fan, which can be used in conjunction with the heat sinks to dissipate the heat at a faster rate. The fan is designed to draw in cool air from outside the system and then blow the air directly over the heat sinks, helping to dissipate the heat from the system. The fan also helps to reduce the noise produced by the system.
The ATS-20D-193-C1-R0 heat sink is used in a wide range of applications, including servers, computers, phones, industrial controls, and consumer electronics. The module is suitable for operating temperatures up to 80 degrees Celsius, making it an excellent choice for applications running on high temperature components.
The ATS-20D-193-C1-R0 heat sink is designed to improve the thermal efficiency and reliability of electronic systems. The heat sink helps to reduce the level of heat generated by components, thus reducing the amount of energy required to keep the device operating at full capacity. The advanced fan design also helps to reduce the noise generated by the cooling process, allowing the system to operate quietly while still providing efficient cooling.
Overall, the ATS-20D-193-C1-R0 heat sink is an efficient and reliable thermal management solution. The heat dissipation plate, four heat sinks, and fan provide excellent thermal dissipation and performance, allowing for efficient and reliable operation. The module is suitable for a wide range of applications, including servers, computers, phones, industrial controls, and consumer electronics. The low noise level and excellent thermal dissipation efficiency make it an excellent choice for applications where heat dissipation and reliability are a must.
The specific data is subject to PDF, and the above content is for reference