| Allicdata Part #: | ATS-20D-22-C3-R0-ND |
| Manufacturer Part#: |
ATS-20D-22-C3-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20D-22-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management using heat sinks plays a critical role in the efficient operation of electronic components. The ATS-20D-22-C3-R0 heat sink is a popular choice for applications across numerous industries. The industrial grade heat sink offers reliable cooling performance and features a compact design making it a very attractive solution for thermal management.
The ATS-20D-22-C3-R0 heat sink is a corrosion resistant aluminum unit with copper fins. It features a light, yet robust construction for easy installation. The heat sink is designed to provide efficient heat transfer from an electronic component to the surrounding environment, helping to ensure reliable operation and extended component life.
The ATS-20D-22-C3-R0 heat sink features a highly effective surface area which optimizes heat dissipation. It is designed to function in temperatures of up to 2000°F and utilizes a variety of mounting options. It is RoHS and REACH compliant and is available in multiple size and form factors.
The ATS-20D-22-C3-R0 heat sink is used in a wide range of industrial applications including medical, aerospace, and automotive. It is also widely used in telecommunication and consumer electronics, thanks to its efficient design. The heat sink is used for cooling computer processors and graphics cards, as well as for powering fans, power regulators, and other components.
The ATS-20D-22-C3-R0 heat sink works by dissipating heat from the electronic component it is attached to. Heat is transferred from the component by conduction, convection, and radiation, to the atmosphere surrounding the heat sink. The fins on the heat sink increase its surface area, allowing the component to cool more efficiently. As the fins absorb heat and dissipate it into the atmosphere, air is forced to move across the fins and is cooled by conduction.
The ATS-20D-22-C3-R0 heat sink also works to protect the components from overheating. The fins extend beyond the body of the heat sink, helping to protect it from direct exposure to hot air. This reduces the risk of thermal runaway due to overheating, which can cause component failure.
The ATS-20D-22-C3-R0 heat sink is an effective and reliable way to control thermal performance in industrial applications. Its compact design, efficient cooling performance, and a variety of mounting options make it a very attractive solution for thermal management.
The specific data is subject to PDF, and the above content is for reference