| Allicdata Part #: | ATS-20D-33-C2-R0-ND |
| Manufacturer Part#: |
ATS-20D-33-C2-R0 |
| Price: | $ 5.98 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X17.78MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20D-33-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.37831 |
| 30 +: | $ 5.07969 |
| 50 +: | $ 4.78094 |
| 100 +: | $ 4.48213 |
| 250 +: | $ 4.18333 |
| 500 +: | $ 3.88452 |
| 1000 +: | $ 3.80982 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are incredibly important parts in electronics design. They are the way we transfer heat away from sensitive components. Without heat sinks, the temperatures around the components can become so high that the components may fail. In this article we\'re going to talk about the ATS-20D-33-C2-R0 heat sink and its applications and how it works.
The ATS-20D-33-C2-R0 heat sink is a precision extruded heat sink designed to dissipate unwanted heat from electronic components. It\'s unique open-frame design creates a low pressure drop that improves air circulation around the component for better cooling efficiency. The ATS-20D-33-C2-R0 is well-suited for applications where high performance and low noise levels are required.
The open-frame design of the ATS-20D-33-C2-R0 heat sink makes it ideal for applications where high performance cooling is required with minimal airflow obstruction. The heat sink features a rectangular shape with air ports on the top and bottom sides to allow air to flow into and out of the heat sink. The ports on the sides are designed to minimize turbulence for maximum cooling efficiency.
The ATS-20D-33-C2-R0 heat sink is made from high quality aluminum and has a low thermal resistance. This makes it a great choice for applications requiring high thermal performance and low noise. It\'s available in a variety of sizes ranging from 14.2mm x 14.2mm to 27.4mm x 27.4mm.
The ATS-20D-33-C2-R0 heat sink is designed to be used with a direct contact cooling method. The thermal conductivity of aluminum gives it a high rate of cooling, so when it is connected to a hot component, the heat is quickly drawn away and dissipated into the surroundings. This ensures that the components remain within their safe temperature range.
The ATS-20D-33-C2-R0 heat sink is designed to be used with a wide range of thermally conductive materials such as metal meshes, silicone, and heatsinks. It can also be used in combination with other components such as fans and water cooling systems to provide extra cooling power.
The ATS-20D-33-C2-R0 heat sink is an ideal solution for cooling electronic components in a variety of applications such as computers, home appliances, medical equipment, and industrial equipment. It\'s low thermal resistance makes it well-suited for applications where high performance cooling is required with minimal airflow obstruction. The heat sink is available in a variety of sizes and is easy to install, making it a great choice for applications where space is limited.
The specific data is subject to PDF, and the above content is for reference