| Allicdata Part #: | ATS-20D-59-C3-R0-ND |
| Manufacturer Part#: |
ATS-20D-59-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20D-59-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-20D-59-C3-R0 heat sink is a thermal product used for cooling electrical and electronic components. It is manufactured in a variety of sizes, shapes, and materials to suit a wide range of applications and specifications. This article will discuss the application field and working principle of the ATS-20D-59-C3-R0 heat sink.
Application Field
The ATS-20D-59-C3-R0 is designed for cooling components such as power semiconductors, voltage regulators, light-emitting diodes (LEDs), transistors, and other components. It can also be used to dissipate excess heat from high-voltage circuits, as well as act as a heat pipe to further enhance cooling. It is suitable for a variety of applications, ranging from consumer electronics and medical equipment to industrial and military applications.
The ATS-20D-59-C3-R0 heat sink can be installed in a variety of spaces due to its compact size. It is suitable for confined spaces and can be installed in slanted, vertical, or horizontal blocks. It is also dimensionally compatible with other ATS-20D-59-C3-R0 models.
Working Principle
The working principle of the ATS-20D-59-C3-R0 is based on the thermodynamic process of heat transfer. Heat is exchanged between the base plate and the heat fins due to the differential temperatures between the two. The difference in temperature creates a thermal gradient, resulting in heat energy being transferred from the base plate to the heat fins. This allows the heat to spread evenly throughout the device, resulting in an efficient cooling system.
The ATS-20D-59-C3-R0 heat sink uses air flow to improve its cooling efficiency. Heat is dissipated more rapidly when air, or a gas, is transferred between the fins of the heat sink. This means that the air flow around the heat sink helps to remove heat more quickly allowing for better cooling.
The ATS-20D-59-C3-R0 heat sink can also be used in conjunction with other thermal control systems. For example, the use of a fan or liquid cooling system can greatly increase its efficiency. The fan can be used to create an air flow over the surface of the fins, while the liquid cooling system can reduce temperatures further by carrying the heat away from the heat sink.
Conclusion
The ATS-20D-59-C3-R0 heat sink is a thermal product designed to dissipate heat and improve the cooling efficiency of electrical and electronic components. It is suitable for a variety of applications, ranging from consumer electronics and medical equipment to industrial and military applications. Its working principle is based on the thermodynamic process of heat transfer, while air flow can be used to improve cooling efficiency. Additionally, the ATS-20D-59-C3-R0 heat sink can be used in conjunction with other thermal control systems such as fans or liquid cooling systems.
The specific data is subject to PDF, and the above content is for reference