| Allicdata Part #: | ATS-20E-05-C3-R0-ND |
| Manufacturer Part#: |
ATS-20E-05-C3-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20E-05-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49524 |
| 30 +: | $ 3.40074 |
| 50 +: | $ 3.21174 |
| 100 +: | $ 3.02280 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.73940 |
| 1000 +: | $ 2.45602 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks:
Heat sink technology is used to decrease the heat produced by electrical and mechanical components. Heat sinks act as barriers that trap and dissipate heat away from a component, allowing it to operate at a manageable temperature. Heat sinks are especially important for thermally sensitive components, as they help to keep temperatures within an acceptable range.
ATS-20E-05-C3-R0 application field:
The ATS-20E-05-C3-R0 is a high performance thermal heat sink designed for cooling high speed microprocessors and complex high power devices. It features a lightweight aluminum fin-stack, integrated mounting brackets, and ultra-low power consumption. The ATS-20E-05-C3-R0 is a small form factor solution that is perfect for embedded applications where space is limited.
Working principle of ATS-20E-05-C3-R0:
The ATS-20E-05-C3-R0 utilizes both thermal conductivity and convection to create effective cooling. The aluminum fin-stack is designed to maximize surface area and provide an effective platform for efficient heat transfer. The integrated mounting brackets facilitate easy installation, and the fans provide additional cooling air to further improve heat dissipation. By combining these technologies, the ATS-20E-05-C3-R0 is able to maintain a stable temperature in thermal-sensitive applications.
The ATS-20E-05-C3-R0 is an economical and reliable solution for cooling high speed microprocessors and other complex high power devices. The fin-stack offers a lightweight and efficient solution for dissipating heat, while the integrated mounting brackets and fans ensure quick and easy installation. The ATS-20E-05-C3-R0 is an ideal choice for any application where thermal management is required.
The specific data is subject to PDF, and the above content is for reference