Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.15°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-20E-06-C1-R0 is a thermal heat sink commonly used in a variety of industries and applications. This heat sink is a relatively simple component that offers much beneficial thermal control. It is capable of dissipating large quantities of heat generated by components in contact with it, keeping them from overheating and failing. This heat sink is an efficient and affordable way to maintain system coolness even in the most demanding environments.

Design and Construction

The ATS-20E-06-C1-R0 heat sink is a one piece aluminum extrusion heat sink. It is constructed with high grade, 6061-T6 aluminum in a 0.56" (14.2mm) high, 0.73" (18.5mm) wide aluminum structure. The 0.06" (1.5mm) thickness aluminum structure features a louvered design to maximize available surface area and airflow while still being compact in size. There are multiple mounting holes at the back of this heat sink which allow it to be easily installed on a board or any application that requires heat dissipation.Not only is the ATS-20E-06-C1-R0 a highly efficient heat sink, but it is also flexible. It is capable of dissipating both DCM and IPM motor drives, making it suitable for a variety of applications. In addition, its compactness makes it ideal for limited spaces, while the multiple mounting holes make it easily installable.

Performance

The ATS-20E-06-C1-R0 heat sink is designed to be efficient and reliable. It features a low thermal resistance spring clip system, which ensures optimal contact with the component and maximizes thermal efficiency. This heat sink is capable of dissipating heat up to 120°C with a thermal resistance range of 0.74 K/W. It also features high-strength mounting and grounding hardware, making it rugged and easy to install.The ATS-20E-06-C1-R0 has been engineered with multiple layers of aluminum fins, which offer superior airflow and increased thermal dissipation. This ensures optimal heat dissipation during a wide range of operating conditions. In addition, the 0.06” (1.5mm) thickness aluminum construction allows for an array of cooling fan options, which add to its overall efficiency.

Applications

Due to its high thermal capacity and superior thermal efficiency, the ATS-20E-06-C1-R0 is ideal for a wide variety of commercial building projects. In addition, the components utilized in the construction of this heat sink makes it ideal for use in medical devices, telecommunications systems, industrial machinery, gaming consoles, as well as industrial and automotive applications. Ideal for applications that require light and efficient thermal management, the ATS-20E-06-C1-R0 can be used to help maintain peak performance without the cost or maintenance of liquid cooling systems. Its superior design and construction make it reliable and capable of dissipating large quantities of heat.

Conclusion

The ATS-20E-06-C1-R0 is a heat sink that offers powerful thermal performance and is suitable for many industrial, medical, automotive, and telecommunications applications. The high grade aluminum construction ensures it is capable of dissipating large amounts of heat while still being lightweight and affordable. It is capable of maintaining system coolness even in the most demanding environments, making it an ideal component for those who need efficient thermal management.

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