| Allicdata Part #: | ATS-20E-103-C1-R1-ND |
| Manufacturer Part#: |
ATS-20E-103-C1-R1 |
| Price: | $ 4.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X9.5MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20E-103-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.87513 |
| 30 +: | $ 3.65967 |
| 50 +: | $ 3.44434 |
| 100 +: | $ 3.22906 |
| 250 +: | $ 3.01379 |
| 500 +: | $ 2.79852 |
| 1000 +: | $ 2.74471 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.64°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used to cool electronic components and devices that create a lot of heat during operation. The ATS-20E-103-C1-R1 is an example of a thermal heat sink which specifically designed to offer optimal cooling solutions for high-power components such as CPU’s, microprocessors, GPUs and other integrated circuits.
Application Field
The ATS-20E-103-C1-R1 is designed for high power applications that require a heat sink capable of transferring heat away from the component efficiently. It can be used in a variety of electronic components, from processor chips to laser devices. The aluminum heat sink is designed to offer optimal cooling for the component without having to use any additional fans or other cooling components. In addition, the heat sink can be used in applications with limited space, due to its low profile design.
Working Principle
The ATS-20E-103-C1-R1 is a thermal heat sink that functions by transferring heat away from the component it is attached to. The heat sink is made up of an aluminum base that is machined to feature special cut-outs designed for greater airflow. This increased airflow helps the heat sink to absorb and effectively dissipate the heat away from the component it is attached to. The aluminum base is then covered by heat-dispersing fins that further increase the surface area available for heat dissipation. The fins act as a conduit for the air surrounding the heat sink to help efficiently transfer the heat away from the component. The increased surface area also allows for more heat to be absorbed away from the component, while also keeping the temperature of the component low which helps it to operate at its optimal settings.
The ATS-20E-103-C1-R1 is a great example of a thermal heat sink that is designed to provide reliable and efficient cooling solutions for high-power components such as processors, GPUs, lasers and other integrated circuits. It is capable of operating in a variety of environments and it is a great option for those looking for a reliable and effective cooling solution for their electronic components.
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