ATS-20E-116-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.26°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Application Field and Working Principle of ATS-20E-116-C3-R0 Thermal - Heat Sinks

Thermal - Heat Sinks are essential components in electronic products which require thermal management, in order to ensure proper operation and lifetime of the product. Because of the ever-increasing needs of high performance and high functionality, these components are becoming increasingly important to electronic design engineers. ATS-20E-116-C3-R0 is a thermal-heat sink manufactured by Amacor Electronics and is renowned for its high quality and performance. In this article, we will discuss the application field and working principle of the ATS-20E-116-C3-R0 thermal-heat sink.

Application Field of ATS-20E-116-C3-R0 Thermal-Heat Sinks

The ATS-20E-116-C3-R0 thermal-heat sink is a high-performance component designed to be used in a wide range of applications. It is particularly suitable for products which require high power and a high level of thermal management. These products would typically include power supplies, power amplifiers, microprocessors, servers, communication base stations, and other products which generate a significant amount of heat. The ATS-20E-116-C3-R0 thermal-heat sink has an optimized design which offers superior performance in these applications.

Working Principle of ATS-20E-116-C3-R0 Thermal-Heat Sinks

The ATS-20E-116-C3-R0 thermal-heat sink works by transferring heat away from the target component, thus preventing it from reaching too high a temperature which could damage or degrade its performance. The first step of the process is to provide an efficient thermal interface between the heat sink and the target component. This is usually achieved by using thermal grease or thermal paste, or by using a thermally conductive insulator such as a heatsink pad. This ensures that the heat generated by the component is efficiently transferred to the heat sink.Once the heat has been transferred to the heat sink, it is then dissipated into the environment, usually with the help of a fan or some other type of cooling device. The heat sink itself is designed to maximize the surface area for efficient heat dissipation. It also typically features fins or ridges which increase the surface area and improve the overall cooling capacity. The materials used to make the heat sink also play a key role in its efficiency – aluminum is one of the most common materials used for heat sinks as it has excellent thermal conductivity and is lightweight.To ensure that the heat is dissipated effectively, the heat sink needs to be properly mounted on the circuit board and have some type of airflow within its system. This is usually provided by either mounting the heat sink directly onto a fan, or by using airflow devices such as ducts or vortices. Additionally, the heat sink should always be mounted to a large metal surface such as a heatsink plate. This will ensure that the heat is able to freely dissipate into the surrounding environment.

Conclusion

In conclusion, the ATS-20E-116-C3-R0 thermal-heat sink is a highly efficient component that is designed for a wide range of applications. It functions by providing an efficient thermal interface between the component and the heat sink, and then efficiently dissipating the generated heat into the environment. This ensures that the target component remains cool, ensuring its performance and lifetime.

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