| Allicdata Part #: | ATS-20E-154-C3-R0-ND |
| Manufacturer Part#: |
ATS-20E-154-C3-R0 |
| Price: | $ 4.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20E-154-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.64329 |
| 30 +: | $ 3.44106 |
| 50 +: | $ 3.23870 |
| 100 +: | $ 3.03629 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.63145 |
| 1000 +: | $ 2.58084 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.61°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal-heat sink is primarily used to dissipate heat generated by an integrated circuit (IC). ATS-20E-154-C3-R0 is a thermal-heat sink or heat spreader designed for use in conjunction with a wide variety of high-power ICs. This type of heat sink has been used widely in electronic devices such as computers, power supplies, and audio products.
A thermal-heat sink is composed of thermally conductive components; usually a metal frame and fins made from aluminum or copper. The fins are usually designed with a staggered array of fins that increase surface area to allow for rapid heat dissipation. Some ATS-20E-154-C3-R0 models come with fins with full grooves for better dissipation. The heat sink has a series of pins at the base used to anchor it to an integrated circuit board.
The main purpose of a thermal-heat sink is to dissipate heat generated by an integrated circuit into the surrounding air. This is accomplished by increasing the surface area of the heat sink and decreasing the resistance to heat transfer. This is done by increasing the number of fins, the height of the fins, and the length of the fins. In order to achieve this increased dissipative area, ATS-20E-154-C3-R0 utilizes an array of fins staggered in a specific pattern. This allows for more efficient heat transfer due to airflow generated through the fins when the device is cooled by a fan or other cooling method. In addition, the increased surface area reduces the amount of heat that is necessary to be dissipated from a given IC.
In order to optimize the performance of ATS-20E-154-C3-R0, the heat sink should be installed on a motherboard with a smooth and even surface. If a uneven surface is present, the thermal conductivity of the heat sink will be reduced. The thermal-heat sink should also be mounted in the correct orientation so that the cooling fins are positioned in the correct direction to maximize airflow. If the fins are not aligned correctly with the airflow, then the heat dissipating capabilities of the heat sink will be greatly reduced.
The principle of operation of ATS-20E-154-C3-R0 is based on the concept of conduction. When the IC generates heat, the heat is conducted through the heat sink body to the louvered fins. The heat is then dissipated into the surrounding air by convection. This enables the integrated circuit to remain cooler, improving its performance and reliability.
ATS-20E-154-C3-R0 is used in a wide range of applications, including computers, power supplies, audio products, and other electronics. It is an essential component in any high-power electronic device as it prevents the excessive build-up of heat, which can cause damage to the IC and other components. The effectiveness of the thermal-heat sink relies heavily on its design and construction, and it is important to ensure that it is correctly mounted and orientated for optimal performance.
The specific data is subject to PDF, and the above content is for reference