ATS-20E-16-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20E-16-C3-R0-ND

Manufacturer Part#:

ATS-20E-16-C3-R0

Price: $ 4.11
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20E-16-C3-R0 datasheetATS-20E-16-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.73590
30 +: $ 3.52842
50 +: $ 3.32098
100 +: $ 3.11340
250 +: $ 2.90584
500 +: $ 2.69828
1000 +: $ 2.64639
Stock 1000Can Ship Immediately
$ 4.11
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.14°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are vitally important in many applications due to the sensitive nature of the products involved or the environment where todays products are used. Heat sinks are frequently employed in thermal management solutions and ATS-20E-16-C3-R0 is a popularly utilized one due to its efficient design and reliable performance. Relatively small in size (59.3 x 27.9 x 6.5 mm), ATS-20E-16-C3-R0 is a ready-to-use heat sink featuring a simple but powerful design that dissipates the heat generated by high-power electronic components. This makes the device suitable for use in a wide range of applications, including power transistors, mains voltage rectifiers, processors, power electronic components, and industrial-grade power supplies.

The core of the ATS-20E-16-C3-R0 design is its innovative dual-layer heat sink, which features a finned plate inside the body with an exceptionally wide contact area. This unique design provides higher thermal capacity and allows the device to dissipate heat efficiently. The heat sink is typically fabricated using aluminum with a surface black coating to improve its heat dissipation properties and to enable it to work in high temperature applications. It also provides increased heat dissipation in its convective, natural and forced modes of operation. The ATS-20E-16-C3-R0 also features large thermal lobes which ensure that the thermal flow is optimized and direct the heat away from the component.

In addition, the ATS-20E-16-C3-R0 features an excellent heat dissipation capacity that delivers an impressive thermal resistance of 0.62°C/W. This efficiency enables the heat sink to dissipate large amounts of heat quickly and effectively, even in tough environments. The device’s mounting system is also designed to be rigid and reliable, providing a stable mounting system that makes it suited for use in even the harshest of environments.

In terms of operation, the ATS-20E-16-C3-R0 works on the principle of convection. This is a process where air around the heat sink moves in a natural way due to the warm air produced as the component produces heat. In summary, the ATS-20E-16-C3-R0 is designed to be an efficient and reliable ready to use heat sink. Its innovative design allows it to dissipate large amounts of heat quickly and effectively, making it suitable for use in a wide range of applications. This makes it the ideal solution for thermal management solutions in today’s challenging environments.

The specific data is subject to PDF, and the above content is for reference

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