| Allicdata Part #: | ATS-20E-160-C1-R0-ND |
| Manufacturer Part#: |
ATS-20E-160-C1-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20E-160-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.65°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-20E-160-C1-R0 Application Field and Working Principle
The ATS-20E-160-C1-R0 Heat Sink is a low profile thermal solution designed especially for small form factor applications. It features an extended fin length for superior cooling performance and features two-level heatsink fins. The design of the ATS-20E-160-C1-R0 Heat Sink incorporates a nickel-plated aluminum base and is constructed using a die-cast manufacturing process. The ATS-20E-160-C1-R0 Heat Sink is compatible with Intel LGA 1155/1156/1150/1151/1155/1366/2011/2066 sockets.
The main application field of ATS-20E-160-C1-R0 Heat Sink is computer systems, servers and other electronic devices which require a higher cooling efficiency in a small space. Due to its compact size, it can easily be installed inside slim and small PCs, HTPCs (Home Theater PCs) and Mini-ITX cases without interferences. This makes it the ideal option for applications where space is a constraint.
The working principle of ATS-20E-160-C1-R0 Heat Sink is based on the principles of thermal heat dissipation. The heat generated by electronic components is transferred to the heat sink fins via the conduction along the heat sink base. The heat sink fins then dissipates the heat into the air. In order to maximize the heat dissipation, the ATS-20E-160-C1-R0 Heat Sink features two-level fins, which increases the surface area exposed to air without occupying too much space. The heat dissipation performance of the ATS-20E-160-C1-R0 Heat Sink can be further improved by using additional heat sinks or fan systems.
The ATS-20E-160-C1-R0 Heat Sink is designed to offer superior cooling performance in a small form factor and is an ideal choice for creating a highly efficient thermal system for a wide range of applications. Its low profile design and extended fin length makes it ideal for applications where space is a constraint, while the nickel-plated aluminum base ensures maximum heat conduction.
The specific data is subject to PDF, and the above content is for reference