Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-20E-20-C3-R0 is a superior thermal management solution designed to keep electronic components cool while operating in high temperature environments. It is a type of heat sink, a device that efficiently dissipates heat generated by electronics as part of their normal operation.

ATS-20E-20-C3 Applications

The ATS-20E-20-C3 is designed for use in a wide variety of applications, including industrial electronics, aerospace and defense applications, as well as commercial and consumer electronics. It is particularly effective for cooling high power devices such as power amplifiers and other components which generate significant amounts of heat.The ATS20E-20-C3 is rugged and durable, and is designed for use in both indoor and outdoor environments. It is also designed for long-term operation at temperature ranges from -20°C to +100°C. It is also designed for installation in either stationary or mobile applications.

Heat Sink Technology

Heat sinks are devices that dissipate heat generated by electronic components during their normal operation. This heat can be transferred through air or liquid. In the case of the ATS-20E-20-C3, heat is dissipated via air.Heat sinks transfer heat through a combination of conduction and convection. Heat is conducted to the heat sink via conduction and then dispersed through convection. The ATS-20E-20-C3 is designed with a variety of features to maximize heat transfer efficiency, such as the use of fins that increase surface area in contact with the air and provide maximum heat transfer.

ATS-20E-20-C3 Design Features

The ATS-20E-20-C3 is designed with a range of features to maximize its thermally efficient properties, including:• Fins – The heat sink’s fin design increases its surface area, allowing more air contact for more efficient heat dissipation.• Heat Pipes – Heat pipes are integrated into the heat sink’s construction to rapidly conduct heat away from the heat source within a fraction of a second. This is achieved using a phase change process within the heatpipe.• Heat Spreaders – Heat spreaders are located between the heat source and the heat sink to maximize the efficiency of heat transfer.• Soldering – All connections are soldered to ensure long-term operating performance.The ATS-20E-20-C3 also features a rugged, anodized aluminum construction and a black powder coat finish for superior corrosion resistance.

Conclusion

The ATS-20E-20-C3 is a superior heat sink designed with features to maximize efficiency and long-term performance. Its rugged construction, long-term operation temperature ranges, and versatile application fields makes it the ideal solution for cooling high-powered electronics in a wide variety of settings.

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